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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Server Board S2600WP

Specifications

Export specifications

Essentials

Supplemental Information

  • Embedded Options Available No
  • Datasheet View now
  • Description A high density server board supporting two Intel® Xeon processors E5-2600 family, 16 total DIMMs with two DIMM per Channel designed for maximum memory capability and I/O capability; an ideal option for Datacenters and High Performance Computing.

Memory Specifications

GPU Specifications

Package Specifications

  • Max CPU Configuration 2

Ordering and Compliance

Retired and discontinued

Intel® Server Board S2600WP, OEM 10 Pack

  • MM# 919026
  • Ordering Code BBS2600WP

Trade compliance information

  • ECCN 5A992C
  • CCATS G145323
  • US HTS 8473301180

PCN Information

Compatible Products

Intel® Xeon® Processor E5 v2 Family

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Intel® Xeon® Processor E5 Family

Product Name Launch Date Total Cores Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Xeon® Processor E5-2603 Q1'12 4 1.80 GHz 10 MB Intel® Smart Cache 80 W 2903
Intel® Xeon® Processor E5-2609 Q1'12 4 2.40 GHz 10 MB Intel® Smart Cache 80 W 2953
Intel® Xeon® Processor E5-2620 Q1'12 6 2.50 GHz 2.00 GHz 15 MB Intel® Smart Cache 95 W 2998
Intel® Xeon® Processor E5-2630 Q1'12 6 2.80 GHz 2.30 GHz 15 MB Intel® Smart Cache 95 W 3086
Intel® Xeon® Processor E5-2630L Q1'12 6 2.50 GHz 2.00 GHz 15 MB Intel® Smart Cache 60 W 3119
Intel® Xeon® Processor E5-2637 Q1'12 2 3.50 GHz 3.00 GHz 5 MB Intel® Smart Cache 80 W 3162
Intel® Xeon® Processor E5-2640 Q1'12 6 3.00 GHz 2.50 GHz 15 MB Intel® Smart Cache 95 W 3175
Intel® Xeon® Processor E5-2643 Q1'12 4 3.50 GHz 3.30 GHz 10 MB Intel® Smart Cache 130 W 3205
Intel® Xeon® Processor E5-2648L Q1'12 8 2.10 GHz 1.80 GHz 20 MB Intel® Smart Cache 70 W 3210
Intel® Xeon® Processor E5-2650 Q1'12 8 2.80 GHz 2.00 GHz 20 MB Intel® Smart Cache 95 W 3218
Intel® Xeon® Processor E5-2650L Q1'12 8 2.30 GHz 1.80 GHz 20 MB Intel® Smart Cache 70 W 3229
Intel® Xeon® Processor E5-2658 Q1'12 8 2.40 GHz 2.10 GHz 20 MB Intel® Smart Cache 95 W 3237
Intel® Xeon® Processor E5-2660 Q1'12 8 3.00 GHz 2.20 GHz 20 MB Intel® Smart Cache 95 W 3245
Intel® Xeon® Processor E5-2665 Q1'12 8 3.10 GHz 2.40 GHz 20 MB Intel® Smart Cache 115 W 3255
Intel® Xeon® Processor E5-2667 Q1'12 6 3.50 GHz 2.90 GHz 15 MB Intel® Smart Cache 130 W 3266
Intel® Xeon® Processor E5-2670 Q1'12 8 3.30 GHz 2.60 GHz 20 MB Intel® Smart Cache 115 W 3275
Intel® Xeon® Processor E5-2680 Q1'12 8 3.50 GHz 2.70 GHz 20 MB Intel® Smart Cache 130 W 3286

Intel® Integrated RAID (Modules/System Boards)

Product Name Marketing Status Board Form Factor RAID Level Supported # of Ports Internal # of Ports External Sort Order Compare
All | None
Intel® Integrated RAID Module RMS25KB080 Discontinued Low Profile MD2 Card 0, 1, 1E, 10 8 0 62960
Intel® Integrated RAID Module RMS25KB040 Discontinued Low Profile MD2 Card 0, 1, 1E, 10 4 0 62962

Intel® RAID Controllers

Product Name Marketing Status Board Form Factor RAID Level Supported # of Ports Internal # of Ports External Sort Order Compare
All | None
Intel® RAID Controller RS3FC044 Discontinued Low Profile MD2 Card 0, 1, 1E, 10 4 4 63143
Intel® RAID Controller RS25DB080 Discontinued Low Profile MD2 Card 0, 1, 10, 5, 50, 6, 60 8 0 1GB 63153
Intel® RAID Controller RS25NB008 Discontinued Low Profile MD2 Card 0, 1, 10, 5, 50, 6, 60 0 8 1GB 63156
Intel® RAID Controller RS25SB008 Discontinued Low Profile MD2 Card 0, 1, 10, 5, 50, 6, 60 0 8 1GB 63159
Intel® RAID Controller RS25FB044 Discontinued Low Profile MD2 Card 0, 1, 1E, 10 4 4 None 63162
Intel® RAID Controller RS25GB008 Discontinued Low Profile MD2 Card JBOD 0 8 None 63163
Intel® RAID Controller RS2BL040 Discontinued Low Profile MD2 Card 0, 1, 10, 5, 50, 6, 60 4 0 512MB 63166
Intel® RAID Controller RS2BL080 Discontinued Low Profile MD2 Card 0, 1, 10, 5, 50, 6, 60 8 0 512MB 63168
Intel® RAID Controller RS2MB044 Discontinued Low Profile MD2 Card 0, 1, 10, 5, 50, 6, 60 4 4 512MB 63173
Intel® RAID Controller RS2PI008 Discontinued Low Profile MD2 Card 0, 1, 10, 5, 50, 6, 60 0 8 512MB 63174
Intel® RAID Controller RS2SG244 Discontinued Full Height 1/2 Length PCIe Card 0, 1, 10, 5, 50, 6, 60 24 4 512MB 63176
Intel® RAID Controller RS2VB080 Discontinued Low Profile MD2 Card 0, 1, 10, 5, 50, 6, 60 8 512MB 63178
Intel® RAID Controller RS2WC040 Discontinued Low Profile MD2 Card 0, 1, 10, 5, 50 4 0 None 63179
Intel® RAID Controller RS2WC080 Discontinued Low Profile MD2 Card 0, 1, 10, 5, 50 8 0 None 63180
Intel® RAID Controller RS2WG160 Discontinued Full Height 1/2 Length PCIe Card 0, 1, 10, 5, 50, 6, 60 16 0 512MB 63181
Intel® RAID Controller RT3WB080 Discontinued Low Profile MD2 Card 0, 1, 10, 5, 50, 6, 60 8 0 256MB 63183

Intel® RAID Software

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Drive Bay Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
RMM4 & rIOM Carrier Board Kit AXXRMM4IOMW Q1'12 Discontinued 64295

Management Module Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Remote Management Module AXXRMM4LITE Q2'11 Discontinued 64479

Spare Heat-Sink Options

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All | None

Intel® Server Component Extended Warranty

Product Name Launch Date Marketing Status Sort Order Compare
All | None
Dual Processor Board Extended Warranty Q2'11 Discontinued 65454

Intel® Compute Module HNS2600WP Family

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All | None

Intel® Server System H2000WP Family

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All | None

Intel® Ethernet Converged Network Adapter X540

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All | None

Intel® Ethernet Server Adapter X520

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Intel® Ethernet Server Adapter I350 Series

Product Name Embedded Options Available Cabling Type TDP Port Configuration System Interface Type Sort Order Compare
All | None
Intel® Ethernet Server Adapter I350-F2 No MMF 50um up to 550m; MMF 62.5um up to 275m 5.5 W Dual PCIe v2.1 (5.0 GT/s) 52511
Intel® Ethernet Server Adapter I350-F4 No MMF 50um up to 550m; MMF 62.5um up to 275m 6 W Quad PCIe v2.1 (5.0 GT/s) 52514

Intel® PRO/1000 PT Server Adapter Series

Product Name Embedded Options Available Cabling Type TDP Port Configuration System Interface Type Sort Order Compare
All | None
Intel® PRO/1000 PT Dual Port Server Adapter No Category-5 up to 100m 4.95 W Dual PCIe v1.0a (2.5 GT/s) 53152
Intel® PRO/1000 PT Quad Port Low Profile Server Adapter No Category-5 up to 100m 12 W Quad PCIe v1.0a (2.5 GT/s) 53171

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Onboard Network Driver for Windows* for Legacy Intel® Server Boards and Systems

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Intel® Embedded Server RAID Technology 2 (ESRT2) Linux* Driver for Intel® Server Boards and Systems Based on Intel® 60X Chipset

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Intel® Server Chipset Driver for Windows* for legacy Intel® Server Board

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Intel® Embedded Server RAID Technology 2 (ESRT2) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 60X Chipset

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Firmware Update Package Update for EFI Intel® Server Boards and Intel® Server Systems Based on Intel® 60X Chipset

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Intel® Rapid Storage Technology Enterprise (Intel® RSTe) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 60X Chipset

View Details

Onboard Video Driver for Windows* for Legacy Intel® Server Boards and Systems

View Details

RAID Interactive Tutorial for Intel® Rapid Storage Technology Enterprise (Intel® RSTe)

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RAID Interactive Tutorial for Intel® Embedded Software RAID Technology 2 (ESRT2)

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Onboard Network Driver for Linux*

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Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

# of QPI Links

QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Physical Address Extensions

Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.

PCIe x8 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

PCIe x16 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

Connector for Intel® I/O Expansion Module x8 Gen 3

IO expansion indicates a mezzanine connector on Intel® Server Boards that support a variety of Intel® I/O Expansion Modules using a PCI Express* interface. These modules typically have external ports that are accessed on the rear I/O panel.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

# of LAN Ports

LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Firewire

Firewire is a serial bus interface standard for high-speed communication.

Embedded USB (eUSB) Solid State Drive Option

Embedded USB (Universal Serial Bus) supports small USB flash storage devices which can be plugged directly into the board, and can be used for mass storage or a boot device.

Integrated SAS Ports

Integrated SAS indicates Serial Attached SCSI (Small Computer System Interface) support integrated into the board. SAS is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

Integrated InfiniBand*

Infiniband is a switched fabric communications link used in high-performance computing and enterprise data centers.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Quick Resume Technology

Intel® Quick Resume Technology Driver (QRTD) allows the Intel® Viiv™ technology-based PC to behave like a consumer electronic device with instant on/off (after initial boot, when activated) capability.

Intel® Quiet System Technology

Intel® Quiet System Technology can help reduce system noise and heat through more intelligent fan speed control algorithms.

Intel® HD Audio Technology

Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.

Intel® Matrix Storage Technology

Intel® Matrix Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Predecessor to Intel® Rapid Storage Technology

Intel® Rapid Storage Technology

Intel® Rapid Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Successor to Intel® Matrix Storage Technology.

Intel® Rapid Storage Technology enterprise

Intel ® Rapid Storage Technology enterprise (Intel ® RSTe) provides performance and reliability for supported systems equipped with Serial ATA (SATA) devices, Serial Attached SCSI (SAS) devices, and/or solid state drives (SSDs) to enable an optimal enterprise storage solution.

Intel® Fast Memory Access

Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® I/O Acceleration Technology

Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

Intel® Advanced Management Technology

Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Server Customization Technology

Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

Intel® Build Assurance Technology

Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.

Intel® Efficient Power Technology

Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

Intel® Quiet Thermal Technology

Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.