Intel® Desktop Board DH61WW
Specifications
Compare Intel® Products
Essentials
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Product Collection
Intel® Desktop Boards with Intel® H61 Express Chipset
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Marketing Status
Discontinued
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Launch Date
Q1'11
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Board Form Factor
Micro ATX
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Socket
LGA1155
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Extended Life Program (XLP)
No
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TDP
95 W
Supplemental Information
Memory & Storage
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Max Memory Size (dependent on memory type)
16 GB
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Memory Types
Dual DDR3 1066/1333/1600 O.C.
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Max # of Memory Channels
2
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Max # of DIMMs
2
Processor Graphics
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Graphics Output
VGA
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Discrete Graphics
1 PCIe 3.0 x16
Expansion Options
I/O Specifications
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# of USB Ports
6
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USB Revision
2
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USB 2.0 Configuration (External + Internal)
4,2
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USB 3.0 Configuration (External + Internal)
0
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Total # of SATA Ports
4
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Max # of SATA 6.0 Gb/s Ports
0
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# of eSATA Ports
0
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RAID Configuration
N/A
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# of PATA Ports
0
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# of Parallel Ports
1
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Parallel Port via Internal Header
No
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# of Serial Ports
0
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Serial Port via Internal Header
Yes
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Audio (back channel + front channel)
5,1
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Integrated LAN
10/100/1000
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Consumer Infrared Rx Sensor
No
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S/PDIF Out Connector
1
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# of PS2 Ports
1
Package Specifications
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Max CPU Configuration
1
Advanced Technologies
Ordering and Compliance
Retired and discontinued
Trade compliance information
- ECCN 5A992C
- CCATS G400445
- US HTS 8473301180
PCN Information
Drivers and Software
Description
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Launch Date
The date the product was first introduced.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max # of DIMMs
DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
PCI Support
PCI support indicates the type of support for the Peripheral Component Interconnect standard
PCIe x1 Gen 2.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x4 Gen 2.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x8 Gen 2.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x16 Gen 2.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x1 Gen 1.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x4 Gen 1.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x8 Gen 1.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x16 Gen 1.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
RAID Configuration
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
# of PATA Ports
PATA (Parallel ATA) is an interface standard for connection of storage devices in systems, predating SATA.
# of Parallel Ports
A Parallel port is a computer interface used for connecting peripherals, most often printers.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Consumer Infrared Rx Sensor
Indicates presence of an infrared receiver sensor on Intel® NUC products, or capability of previous Intel® Desktop Boards to accept infrared receiver sensor via header.
Intel® HD Audio Technology
Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.
Give Feedback
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.