Intel® 82579V Gigabit Ethernet PHY
Specifications
Compare Intel® Products
Essentials
-
Product Collection
Intel® 82579 Gigabit Ethernet Controller
-
Code Name
Products formerly Lewisville
-
Marketing Status
Discontinued
-
Launch Date
Q1'11
-
Lithography
90 nm
-
TDP
0.66 W
-
Operating Temperature Range
0°C to 85°C
-
Max Operating Temperature
85 °C
-
Minimum Operating Temperature
0 °C
Sign in with your CNDA account to view additional SKU details.
Supplemental Information
-
Embedded Options Available
Yes
-
Datasheet
View now
-
Description
See PCN 118511 for EOL timelines.
-
Product Brief
View now
Networking Specifications
-
Port Configuration
Single
-
Data Rate Per Port
1GbE
-
System Interface Type
Proprietary
-
NC Sideband Interface
No
-
Jumbo Frames Supported
Yes
Package Specifications
-
Package Size
6mm x 6mm
Advanced Technologies
Drivers and Software
Description
Type
More
OS
Version
Date
All
View Details
Download
No results found for
Y
/apps/intel/arksuite/template/arkProductPageTemplate
Latest Drivers & Software
Name
Intel® Ethernet Adapter Complete Driver Pack
Intel® Ethernet Product Release Notes
Administrative Tools for Intel® Network Adapters
Intel® Ethernet Connections Boot Utility, Preboot Images, and EFI Drivers
Adapter User Guide for Intel® Ethernet Adapters
Intel® Network Adapter Driver for Windows 8.1* - FINAL RELEASE
Intel® Ethernet Adapter Drivers for MS-DOS* - FINAL RELEASE
Disabling TCP-IPv6 Checksum Offload Capability with Intel® 1/10 GbE Controllers
Intel® Network Adapter Driver for Windows 8* - Final Release
NVM Update Utility for Intel® 82579V Gigabit Ethernet PHY Network Connection
Support
Launch Date
The date the product was first introduced.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Max Operating Temperature
This is the maximum operating temperature allowed as reported by temperature sensors. Instantaneous temperature may exceed this value for short durations. Note: Maximum observable temperature is configurable by system vendor and can be design specific.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Fiber Channel over Ethernet
Fibre Channel over Ethernet (FCoE) is an encapsulation of Fibre Channel frames over Ethernet networks. This allows Fibre Channel to use 10 Gigabit Ethernet networks (or higher speeds) while preserving the Fibre Channel protocol.
MACsec IEEE 802.1 AE
802.1AE is the IEEE MAC Security (MACsec) standard which defines connectionless data confidentiality and integrity for media access independent protocols.
IEEE 1588
IEEE 1588, also knows as the Precision Time Protocol (PTP) is a protocol used to synchronize clocks throughout a computer network. On a local area network it achieves clock accuracy in the sub-microsecond range, making it suitable for measurement and control systems.
iWARP/RDMA
iWARP delivers converged, low-latency fabric services to data centers through Remote Direct Memory Access (RDMA) over Ethernet. The key iWARP components that deliver low-latency are Kernel Bypass, Direct Data Placement, and Transport Acceleration.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.