Intel® Desktop Board DQ57TML
Specifications
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Essentials
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Product Collection
Legacy Intel® Desktop Boards
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Code Name
Products formerly Tunnel Mountain
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Marketing Status
Discontinued
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Launch Date
Q3'10
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Board Form Factor
micro-ATX
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Socket
LGA1156
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Extended Life Program (XLP)
Yes
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TDP
95 W
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Board Chipset
Intel® Q57 Express Chipset
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Intel vPro® Platform Eligibility ‡
Yes
Supplemental Information
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Embedded Options Available
No
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Datasheet
View now
Memory & Storage
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Max Memory Size (dependent on memory type)
16 GB
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Memory Types
DDR3 1066/1333
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Max # of Memory Channels
2
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Max # of DIMMs
4
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ECC Memory Supported ‡
No
Processor Graphics
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Integrated Graphics ‡
Yes
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Graphics Output
DVI-D, VGA
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# of Displays Supported ‡
2
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Discrete Graphics
PCIe 2.0 x16
Expansion Options
I/O Specifications
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# of USB Ports
12
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USB Revision
2
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USB 2.0 Configuration (External + Internal)
4+8
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Total # of SATA Ports
4
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# of eSATA Ports
0
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RAID Configuration
0,1,5,10 & Matrix
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# of PATA Ports
0
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# of Parallel Ports
1
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Serial Port via Internal Header
Yes
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Audio (back channel + front channel)
4+2
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Integrated LAN
10/100/1000
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Firewire
0
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# of PS2 Ports
1
Package Specifications
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Max CPU Configuration
1
Advanced Technologies
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
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Intel vPro® Platform Eligibility ‡
Yes
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Intel® ME Firmware Version
6.0
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Intel® CIRA Technology
No
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TPM
Yes
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Intel® Quiet System Technology
Yes
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Intel® HD Audio Technology
Yes
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Intel® Matrix Storage Technology
Yes
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Intel® Rapid Storage Technology
Yes
Security & Reliability
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Intel vPro® Eligibility ‡
Intel vPro® Platform
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Intel® Trusted Execution Technology ‡
Yes
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Anti-Theft Technology
No
Ordering and Compliance
Retired and discontinued
Trade compliance information
- ECCN 5A992C
- CCATS G400445
- US HTS 8473301180
PCN Information
Drivers and Software
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Launch Date
The date the product was first introduced.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Intel vPro® Platform Eligibility ‡
The Intel vPro® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability and platform stability.
Learn more about Intel vPro®
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max # of DIMMs
DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
PCI Support
PCI support indicates the type of support for the Peripheral Component Interconnect standard
PCIe x1 Gen 2.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x16 Gen 2.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
RAID Configuration
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
# of PATA Ports
PATA (Parallel ATA) is an interface standard for connection of storage devices in systems, predating SATA.
# of Parallel Ports
A Parallel port is a computer interface used for connecting peripherals, most often printers.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Firewire
Firewire is a serial bus interface standard for high-speed communication.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel vPro® Platform Eligibility ‡
The Intel vPro® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability and platform stability.
Learn more about Intel vPro®
Intel® ME Firmware Version
Intel® Management Engine Firmware (Intel® ME FW) uses built-in platform capabilities and management and security applications to remotely manage networked computing assets out-of-band.
Intel® CIRA Technology
Intel® CIRA Technology (Client Initiated Remote Access) enables out-of-band management such as Intel® AMT, allowing centralized corporate management and administration of laptops that are not attached to the corporate LAN.
TPM
Trusted Platform Module (TPM) is a component on the desktop board that is specifically designed to enhance platform security above-and-beyond the capabilities of today's software by providing a protected space for key operations and other security critical tasks. Using both hardware and software, the TPM protects encryption and signature keys at their most vulnerable stages - operations when the keys are being used unencrypted in plain-text form.
Intel® Quiet System Technology
Intel® Quiet System Technology can help reduce system noise and heat through more intelligent fan speed control algorithms.
Intel® HD Audio Technology
Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.
Intel® Matrix Storage Technology
Intel® Matrix Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Predecessor to Intel® Rapid Storage Technology
Intel® Rapid Storage Technology
Intel® Rapid Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Successor to Intel® Matrix Storage Technology.
Intel vPro® Eligibility ‡
The Intel vPro® platform is a set of hardware and technologies used to build business computing endpoints with premium performance, built-in security, modern manageability, and platform stability. The launch of 12th Gen Intel® Core™ processors introduced Intel vPro® Enterprise and Intel vPro® Essentials branding.
- Intel vPro® Enterprise: Commercial platform offering the full set of security, manageability, and stability features for any given Intel processor generation, including Intel® Active Management Technology
- Intel vPro® Essentials: Commercial platform offering a subset of Intel vPro® Enterprise features, including Intel® Hardware Shield and Intel® Standard Manageability
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Anti-Theft Technology
Intel® Anti-Theft Technology (Intel® AT) helps keep your laptop safe and secure in the event that it’s ever lost or stolen. Intel® AT requires a service subscription from an Intel® AT–enabled service provider.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.