Intel® Compute Module MFS5000SI

Intel® Compute Module MFS5000SI

Specifications

Supplemental Information

Processor Graphics

I/O Specifications

Package Specifications

  • Max CPU Configuration 2
  • Low Halogen Options Available No

Ordering and Compliance

Retired and discontinued

Intel® Compute Module MFS5000SI, Single

  • MM# 900409
  • Ordering Code MFS5000SI

Intel® Compute MFS5000SIB, 3 Pack

  • MM# 892856
  • Ordering Code MFS5000SIB

Intel® Compute Module MFS5000SI, Single

  • MM# 892778
  • Ordering Code MFS5000SI

Intel® Compute MFS5000SIB, 3 Pack

  • MM# 900410
  • Ordering Code MFS5000SIB

Trade compliance information

  • ECCN 5A992C
  • CCATS G135162
  • US HTS 8473301180

PCN/MDDS Information

Compatible products

I/O Options

Product Name Status Embedded Options Available TDP Recommended Customer Price Port Configuration Data Rate Per Port System Interface Type Jumbo Frames Supported SortOrder Compare
All | None
Dual Gigabit Ethernet I/O Expansion Mezzanine Card AXXGBIOMEZ Discontinued

Intel® Modular Server Chassis Family

Product Name Status Board Form Factor Chassis Form Factor Socket Embedded Options Available TDP SortOrder Compare
All | None
Intel® Modular Server Chassis MFSYS25 Discontinued Rack or Pedestal
Intel® Modular Server Chassis MFSYS25V2 Discontinued Pedestal, 6U Rack Option
Intel® Modular Server Chassis MFSYS35 Discontinued Pedestal, 6U Rack Option

Downloads and Software

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Max # of DIMMs

DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.