Intel® Pentium® Processor E5700

2M Cache, 3.00 GHz, 800 MHz FSB

Specifications

Performance Specifications

Supplemental Information

Package Specifications

  • Sockets Supported LGA775
  • Max CPU Configuration 1
  • TCASE 74.1°C
  • Package Size 37.5mm x 37.5mm
  • Processing Die Size 82 mm2
  • # of Processing Die Transistors 228 million

Ordering and Compliance

Retired and discontinued

Intel® Pentium® Processor E5700 (2M Cache, 3.00 GHz, 800 MHz FSB) LGA775, Tray

Boxed Intel® Pentium® Processor E5700 (2M Cache, 3.00 GHz, 800 MHz FSB) LGA775

Trade compliance information

  • ECCN 3A991.A.1
  • CCATS NA
  • US HTS 8542310001

Compatible Products

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Drivers and Software

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Processor Number

The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Physical Core Count

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

For more details regarding the dynamic power and frequency operating range, refer to

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

VID Voltage Range

VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Launch Date

The date the product was first introduced.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TCASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Intel® Demand Based Switching

Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.

Boxed Processor

Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.