Intel® Server System SR1670HV
Compare Intel® Products
Intel® Server System SR1000HV Family
Products formerly Hayden Valley
Thursday, May 31, 2012
Friday, November 30, 2012
Last Receipt Attributes
Sunday, March 31, 2013
Limited 3-year Warranty
Extended Warranty Available for Purchase (Select Countries)
Chassis Form Factor
1.7" x 17.2" x 27"
Compatible Product Series
Heat Sink Included
Intel® Server Board S5500HV
Intel® 5500 I/O Hub
High Performance Computing
Power Supply Type
# of Power Supply Included
Redundant Power Supported
(8) Drive carriers; (2) BMC management modules; (1) Cabled front panel ; (2) Half-height PCI Express riser; (1) SATA backplane; (2) Non-redundant 770W power supply; (8) Non-redundant cooling fans; (4) Processor heatsink; (1) Rack rail set
A rack-optimized, high-performance server system providing two dual-socket 12 DIMM nodes in a 1U chassis focused on maximizing compute density for HPC workloads
Max CPU Configuration
Ordering and Compliance
Retired and discontinued
Trade compliance information
- ECCN Varies By Product
- CCATS Varies By Product
- US HTS 8473305100
Legacy Intel® Xeon® Processors
Intel® RAID Controllers
Spare Chassis Maintenance Options
Spare Drive Bays & Carrier Options
Spare Fan Options
Spare Power Options
Drivers and Software
No results found for
The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
PCIe x16 Gen 2.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
# of LAN Ports
LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.
Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.