Intel® Celeron® M Processor 600 MHz, 512K Cache, 400 MHz FSB

Intel® Celeron® M Processor 600 MHz, 512K Cache, 400 MHz FSB

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Specifications

Performance

Supplemental Information

Package Specifications

Ordering and Compliance

Retired and discontinued

Intel® Celeron® M Processor 600 MHz, 512K Cache, 400 MHz FSB, uFCBGA, Tray

  • MM# 851754
  • Spec Code SL6TZ
  • Ordering Code RJ80535VC600512
  • Shipping Media TRAY
  • Stepping B2

Intel® Celeron® M Processor 600 MHz, 512K Cache, 400 MHz FSB, uFCBGA Pb-Free SLI, Tray

  • MM# 870152
  • Spec Code SL8FN
  • Ordering Code LE80535VC600512
  • Shipping Media TRAY
  • Stepping B1

Intel® Celeron® M Processor 600 MHz, 512K Cache, 400 MHz FSB, uFCBGA, Tray

  • MM# 860721
  • Spec Code SL7GE
  • Ordering Code RJ80535VC600512
  • Shipping Media TRAY
  • Stepping B2

Intel® Celeron® M Processor 600 MHz, 512K Cache, 400 MHz FSB, uFCBGA, Tray

  • MM# 855494
  • Spec Code SL76Q
  • Ordering Code RJ80535VC600512
  • Shipping Media TRAY
  • Stepping BB

Trade compliance information

  • ECCN 3A991.A.2
  • CCATS NA
  • US HTS 8473301180

PCN/MDDS Information

SL8FN

SL6TZ

SL7GE

SL76Q

Downloads and Software

Launch Date

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TJUNCTION

Junction Temperature is the maximum temperature allowed at the processor die.

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.