Intel® X58 Express I/O Hub


Supplemental Information

Processor Graphics

  • Macrovision* License Required No

Expansion Options

Package Specifications

  • Max CPU Configuration 1
  • TCASE 100°C
  • Package Size 37.5mm x 37.5mm

Security & Reliability

Ordering and Compliance

Retired and discontinued

Intel® 82X58 I/O Hub (IOH)

  • MM# 899355
  • Spec Code SLGBT
  • Ordering Code AC82X58
  • Stepping B2
  • MDDS Content IDs 708322

Intel® 82X58 I/O Hub (IOH)

  • MM# 901076
  • Spec Code SLGMX
  • Ordering Code AC82X58
  • Stepping B3
  • MDDS Content IDs 708322

Intel® 82X58 I/O Hub (IOH)

  • MM# 904727
  • Spec Code SLH3M
  • Ordering Code AC82X58
  • Stepping C2
  • MDDS Content IDs 708322

Trade compliance information

  • ECCN 5A992
  • US HTS 8542310001

PCN Information




Compatible Products

Legacy Intel® Xeon® Processors

Product Name Marketing Status Launch Date Total Cores Max Turbo Frequency Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Xeon® Processor W3580 Discontinued Q3'09 4 3.60 GHz 3.33 GHz 8 MB Intel® Smart Cache 130 W 5166
Intel® Xeon® Processor W3570 Discontinued Q1'09 4 3.46 GHz 3.20 GHz 8 MB Intel® Smart Cache 130 W 5171
Intel® Xeon® Processor W3565 Discontinued Q4'09 4 3.46 GHz 3.20 GHz 8 MB Intel® Smart Cache 130 W 5177
Intel® Xeon® Processor W3550 Discontinued Q3'09 4 3.33 GHz 3.06 GHz 8 MB Intel® Smart Cache 130 W 5181
Intel® Xeon® Processor W3540 Discontinued Q1'09 4 3.20 GHz 2.93 GHz 8 MB Intel® Smart Cache 130 W 5186
Intel® Xeon® Processor W3530 Discontinued Q1'10 4 3.06 GHz 2.80 GHz 8 MB Intel® Smart Cache 130 W 5198
Intel® Xeon® Processor W3520 Discontinued Q1'09 4 2.93 GHz 2.66 GHz 8 MB Intel® Smart Cache 130 W 5204

Legacy Intel® Core™ Processors

All | None

Drivers and Software

Latest Drivers & Software

Downloads Available:


Launch Date

The date the product was first introduced.

Supported FSBs

FSB (Front Side Bus) is the interconnect between the processor and the Memory Controller Hub (MCH).

FSB Parity

FSB parity provides error checking on data sent on the FSB (Front Side Bus).


Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.


Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.


Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.