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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® X58 Express I/O Hub

Specifications

Export specifications

Essentials

Supplemental Information

Processor Graphics

  • Macrovision* License Required No

Expansion Options

Package Specifications

  • Max CPU Configuration 1
  • TCASE 100°C
  • Package Size 37.5mm x 37.5mm

Security & Reliability

Ordering and Compliance

Retired and discontinued

Intel® 82X58 I/O Hub (IOH)

  • MM# 899355
  • Spec Code SLGBT
  • Ordering Code AC82X58
  • Stepping B2
  • MDDS Content IDs 708322

Intel® 82X58 I/O Hub (IOH)

  • MM# 901076
  • Spec Code SLGMX
  • Ordering Code AC82X58
  • Stepping B3
  • MDDS Content IDs 708322

Intel® 82X58 I/O Hub (IOH)

  • MM# 904727
  • Spec Code SLH3M
  • Ordering Code AC82X58
  • Stepping C2
  • MDDS Content IDs 708322

Trade compliance information

  • ECCN 5A992
  • CCATS ME
  • US HTS 8542310001

PCN Information

SLGBT

SLGMX

SLH3M

Compatible Products

Legacy Intel® Xeon® Processors

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All | None

Legacy Intel® Core™ Processors

Product Name Marketing Status Launch Date Total Cores Max Turbo Frequency Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Core™ i7-990X Processor Extreme Edition Discontinued Q1'11 6 3.73 GHz 3.46 GHz 12 MB Intel® Smart Cache 130 W 10051
Intel® Core™ i7-980X Processor Extreme Edition Discontinued Q1'10 6 3.60 GHz 3.33 GHz 12 MB Intel® Smart Cache 130 W 10054
Intel® Core™ i7-975 Processor Extreme Edition Discontinued Q2'09 4 3.60 GHz 3.33 GHz 8 MB Intel® Smart Cache 130 W 10065
Intel® Core™ i7-965 Processor Extreme Edition Discontinued Q4'08 4 3.46 GHz 3.20 GHz 8 MB Intel® Smart Cache 130 W 10073
Intel® Core™ i7-980 Processor Discontinued Q2'11 6 3.60 GHz 3.33 GHz 12 MB Intel® Smart Cache 130 W 11267
Intel® Core™ i7-970 Processor Discontinued Q3'10 6 3.46 GHz 3.20 GHz 12 MB Intel® Smart Cache 130 W 11270
Intel® Core™ i7-960 Processor Discontinued Q4'09 4 3.46 GHz 3.20 GHz 8 MB Intel® Smart Cache 130 W 11276
Intel® Core™ i7-950 Processor Discontinued Q2'09 4 3.33 GHz 3.06 GHz 8 MB Intel® Smart Cache 130 W 11292
Intel® Core™ i7-940 Processor Discontinued Q4'08 4 3.20 GHz 2.93 GHz 8 MB Intel® Smart Cache 130 W 11303
Intel® Core™ i7-930 Processor Discontinued Q1'10 4 3.06 GHz 2.80 GHz 8 MB Intel® Smart Cache 130 W 11313
Intel® Core™ i7-920 Processor Discontinued Q4'08 4 2.93 GHz 2.66 GHz 8 MB Intel® Smart Cache 130 W 11319

Drivers and Software

Latest Drivers & Software

Downloads Available:
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Launch Date

The date the product was first introduced.

Supported FSBs

FSB (Front Side Bus) is the interconnect between the processor and the Memory Controller Hub (MCH).

FSB Parity

FSB parity provides error checking on data sent on the FSB (Front Side Bus).

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations ‡

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.

TCASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.