Intel® Server Board S5520HC
Specifications
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Essentials
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Product Collection
Intel® Server Board S5500HC Family
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Code Name
Products formerly Hanlan Creek
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Marketing Status
Discontinued
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Launch Date
Q1'09
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Expected Discontinuance
Q2'13
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EOL Announce
Sunday, June 30, 2013
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Last Order
Tuesday, December 31, 2013
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Last Receipt Attributes
Wednesday, April 30, 2014
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Limited 3-year Warranty
Yes
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Extended Warranty Available for Purchase (Select Countries)
Yes
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# of QPI Links
2
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Compatible Product Series
39565, 47915
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Board Form Factor
SSI EEB (12" X 13")
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Chassis Form Factor
Pedestal
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Socket
LGA1366
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Integrated Systems Available
Yes
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Integrated BMC with IPMI
IPMI 2.0
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TDP
130 W
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Board Chipset
Intel® 5520 I/O Hub
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Target Market
Small and Medium Business
Supplemental Information
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Embedded Options Available
Yes
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Datasheet
View now
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Description
A pedestal-optimized server board designed with world-class performance, scalable management, and maximum expandability for small and medium business applications
Memory Specifications
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Max Memory Size (dependent on memory type)
192.38 GB
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Memory Types
DDR3 ECC UDIMM, RDIMM
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Max # of Memory Channels
6
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Max Memory Bandwidth
64 GB/s
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Max # of DIMMs
12
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ECC Memory Supported ‡
Yes
Processor Graphics
Expansion Options
I/O Specifications
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# of USB Ports
8
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USB Revision
USB 2.0
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Total # of SATA Ports
6
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RAID Configuration
Intel Embedded RAID (0,1); upgradeable to RAID5
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# of Serial Ports
2
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# of LAN Ports
2
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Integrated LAN
2x 1GbE
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Integrated SAS Ports
0
Package Specifications
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Max CPU Configuration
2
Ordering and Compliance
Retired and discontinued
Trade compliance information
- ECCN 5A992C
- CCATS G135162
- US HTS 8473301180
PCN Information
Compatible Products
Legacy Intel® Xeon® Processors
Intel® Integrated RAID (Modules/System Boards)
Intel® RAID Controllers
Heat-Sink Options
Management Module Options
Spare I/O & Management Module Options
Intel® Server Component Extended Warranty
Intel® Server Chassis SC5600 Family
Intel® Server Chassis SC5650 Family
Intel® PRO/1000 PT Server Adapter Series
Drivers and Software
Description
Type
More
OS
Version
Date
All
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Latest Drivers & Software
Name
BIOS Update Package Update for EFI Intel® Server Boards and Intel® Server Systems Based on Intel® 55XX Chipset
RAID Interactive Tutorial for Intel® Rapid Storage Technology Enterprise (Intel® RSTe)
RAID Interactive Tutorial for Intel® Embedded Software RAID Technology 2 (ESRT2)
Platform Confidence Test Utility for the Intel® Server Board S5500 and S5520-Based for EFI
SAS Hardware RAID Driver for VMWare* ESX 4
S5520HC S5500HCV S5520HCT S5520SC BIOS Recovery Package for EFI
Matrox-G200e on-board video driver for Windows*
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
# of QPI Links
QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
Max # of DIMMs
DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
PCIe x8 Gen 2.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x16 Gen 2.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x8 Gen 1.x
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
RAID Configuration
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
# of LAN Ports
LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Integrated SAS Ports
Integrated SAS indicates Serial Attached SCSI (Small Computer System Interface) support integrated into the board. SAS is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
Intel® Advanced Management Technology
Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.
Intel® Server Customization Technology
Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.
Intel® Build Assurance Technology
Intel® Build Assurance technology provides advanced diagnostic features ensuring the most comprehensively tested, most thoroughly debugged, and most stable systems possible are shipped to customers.
Intel® Efficient Power Technology
Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.
Intel® Quiet Thermal Technology
Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.
Give Feedback
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.