Intel® 82GL40 Graphics and Memory Controller Hub


Supplemental Information

Processor Graphics

Package Specifications

  • Max CPU Configuration 1
  • TCASE 100°C
  • Package Size 34mm x 34mm

Security & Reliability

Ordering and Compliance

Retired and discontinued

82GL40 Graphics and Memory Controller Hub (GMCH)

  • MM# 898201
  • Spec Code SLB95
  • Ordering Code AC82GL40
  • Stepping B3
  • MDDS Content IDs 708322

82GL40 Graphics and Memory Controller Hub (GMCH)

  • MM# 900100
  • Spec Code SLGGM
  • Ordering Code AC82GL40
  • Stepping A1
  • MDDS Content IDs 708322

Trade compliance information

  • ECCN 3A991
  • US HTS 8542310001

PCN Information



Compatible Products

Legacy Intel® Celeron® Processor

Product Name Marketing Status Launch Date Total Cores Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Celeron® Processor T3500 Discontinued Q3'10 2 2.10 GHz 1 MB 35 W 23084
Intel® Celeron® Processor T3300 Discontinued Q1'10 2 2.00 GHz 1 MB 35 W 23093
Intel® Celeron® Processor T3100 Discontinued Q3'08 2 1.90 GHz 1 MB L2 Cache 35 W 23103
Intel® Celeron® Processor T1700 Discontinued Q4'08 2 1.83 GHz 1 MB L2 Cache 35 W 23112
Intel® Celeron® Processor T1600 Discontinued Q4'08 2 1.66 GHz 1 MB L2 Cache 35 W 23115
Intel® Celeron® Processor 925 Discontinued Q1'11 1 2.30 GHz 1 MB L2 Cache 35 W 23132
Intel® Celeron® Processor 900 Discontinued Q1'09 1 2.20 GHz 1 MB L2 Cache 35 W 23133
Intel® Celeron® Processor 585 Discontinued Q3'08 1 2.16 GHz 1 MB L2 Cache 31 W 23230
Intel® Celeron® Processor 575 Discontinued Q3'06 1 2.00 GHz 1 MB L2 Cache 31 W 23233

Drivers and Software

Latest Drivers & Software

Downloads Available:


Launch Date

The date the product was first introduced.

Supported FSBs

FSB (Front Side Bus) is the interconnect between the processor and the Memory Controller Hub (MCH).

FSB Parity

FSB parity provides error checking on data sent on the FSB (Front Side Bus).


Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Use Conditions

Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Physical Address Extensions

Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Integrated Graphics

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

Intel® Clear Video Technology

Intel® Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.


Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Fast Memory Access

Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.