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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® 82X48 Memory Controller Hub

Specifications

Export specifications

Essentials

Supplemental Information

Processor Graphics

Package Specifications

  • Max CPU Configuration 1
  • TCASE 84°C
  • Package Size 40mm x 40mm

Ordering and Compliance

Retired and discontinued

Intel® 82X48 Memory Controller Hub (MCH)

  • MM# 895422
  • Spec Code SLASF
  • Ordering Code NU82X48
  • Stepping A1
  • MDDS Content IDs 707871

Trade compliance information

  • ECCN 4A994
  • CCATS NA
  • US HTS 8542310001

PCN Information

SLASF

Compatible Products

Legacy Intel® Core™ Processors

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All | None

Legacy Intel® Pentium® Processor

Product Name Marketing Status Launch Date Total Cores Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Pentium® Processor E6800 Discontinued Q3'10 2 3.33 GHz 2 MB Intel® Smart Cache 65 W 15673
Intel® Pentium® Processor E6700 Discontinued Q2'10 2 3.20 GHz 2 MB Intel® Smart Cache 65 W 15679
Intel® Pentium® Processor E6600 Discontinued Q1'10 2 3.06 GHz 2 MB Intel® Smart Cache 65 W 15687
Intel® Pentium® Processor E6500K Discontinued Q3'09 2 2.93 GHz 2 MB 65 W 15691
Intel® Pentium® Processor E6500 Discontinued Q1'08 2 2.93 GHz 2 MB L2 Cache 65 W 15696
Intel® Pentium® Processor E6300 Discontinued Q2'09 2 2.80 GHz 2 MB L2 Cache 65 W 15708
Intel® Pentium® Processor E5800 Discontinued Q4'10 2 3.20 GHz 2 MB 65 W 15718
Intel® Pentium® Processor E5700 Discontinued Q3'10 2 3.00 GHz 2 MB Intel® Smart Cache 65 W 15721
Intel® Pentium® Processor E5500 Discontinued Q2'10 2 2.80 GHz 2 MB Intel® Smart Cache 65 W 15727
Intel® Pentium® Processor E5400 Discontinued Q1'09 2 2.70 GHz 2 MB L2 Cache 65 W 15736
Intel® Pentium® Processor E5300 Discontinued Q1'08 2 2.60 GHz 2 MB L2 Cache 65 W 15752
Intel® Pentium® Processor E5200 Discontinued Q3'08 2 2.50 GHz 2 MB L2 Cache 65 W 15766
Intel® Pentium® Processor E2220 Discontinued Q1'08 2 2.40 GHz 1 MB L2 Cache 65 W 15790
Intel® Pentium® Processor E2210 Discontinued Q2'09 2 2.20 GHz 1 MB L2 Cache 65 W 15797
Intel® Pentium® Processor E2200 Discontinued Q4'07 2 2.20 GHz 1 MB L2 Cache 65 W 15813
Intel® Pentium® Processor E2180 Discontinued Q3'07 2 2.00 GHz 1 MB L2 Cache 65 W 15823
Intel® Pentium® Processor E2160 Discontinued Q3'06 2 1.80 GHz 1 MB L2 Cache 65 W 15834
Intel® Pentium® Processor E2140 Discontinued Q2'07 2 1.60 GHz 1 MB L2 Cache 65 W 15866

Legacy Intel® Celeron® Processor

Product Name Marketing Status Launch Date Total Cores Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Celeron® Processor E3500 Discontinued Q3'10 2 2.70 GHz 1 MB Intel® Smart Cache 65 W 22944
Intel® Celeron® Processor E3300 Discontinued Q3'09 2 2.50 GHz 1 MB L2 Cache 65 W 22950
Intel® Celeron® Processor E3200 Discontinued Q3'09 2 2.40 GHz 1 MB L2 Cache 65 W 22957
Intel® Celeron® Processor E1600 Discontinued Q2'09 2 2.40 GHz 512 KB L2 Cache 65 W 22968
Intel® Celeron® Processor E1500 Discontinued Q3'06 2 2.20 GHz 512 KB L2 Cache 65 W 22975
Intel® Celeron® Processor E1400 Discontinued Q2'08 2 2.00 GHz 512 KB L2 Cache 65 W 22978
Intel® Celeron® Processor E1200 Discontinued Q1'08 2 1.60 GHz 512 KB L2 Cache 65 W 22988
Intel® Celeron® Processor E3400 Discontinued Q1'10 2 2.60 GHz 1 MB Intel® Smart Cache 65 W 23086

Drivers and Software

Latest Drivers & Software

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Launch Date

The date the product was first introduced.

Supported FSBs

FSB (Front Side Bus) is the interconnect between the processor and the Memory Controller Hub (MCH).

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations ‡

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.

TCASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.