Intel® 82563EB Gigabit Ethernet PHY
Compare Intel® Products
Intel® 82563 Gigabit Ethernet PHY
Products formerly Gilgal
July 28, 2014
Operating Temperature Range
0°C to 60°C
Operating Temperature (Maximum)
Operating Temperature (Minimum)
New Design Availability Expiration Date
Wednesday, January 5, 2011
System Interface Type
NC Sideband Interface
Jumbo Frames Supported
Ordering and Compliance
Retired and discontinued
Trade compliance information
- ECCN 5A991
- CCATS NA
- US HTS 8542310001
- 864999 PCN
- 864991 PCN
Drivers and Software
No results found for
Latest Drivers & Software
Adapter User Guide for Intel® Ethernet Adapters
Administrative Tools for Intel® Network Adapters
Intel® Ethernet Product Release Notes
Intel® Ethernet Adapter Drivers for MS-DOS* - FINAL RELEASE
Disabling TCP-IPv6 Checksum Offload Capability with Intel® 1/10 GbE Controllers
The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Flexible Port Partitioning
Flexible Port Partitioning (FPP) technology utilizes industry standard PCI SIG SR-IOV to efficiently divide your physical Ethernet device into multiple virtual devices, providing Quality of Service by ensuring each process is assigned to a Virtual Function and is provided a fair share of the bandwidth.
Virtual Machine Device Queues (VMDq)
Virtual Machine Device Queues (VMDq) is a technology designed to offload some of the switching done in the VMM (Virtual Machine Monitor) to networking hardware specifically designed for this function. VMDq drastically reduces overhead associated with I/O switching in the VMM which greatly improves throughput and overall system performance
PCI-SIG* SR-IOV Capable
Single-Root I/O Virtualization (SR-IOV) involves natively (directly) sharing a single I/O resource between multiple virtual machines. SR-IOV provides a mechanism by which a Single Root Function (for example a single Ethernet Port) can appear to be multiple separate physical devices.
Fiber Channel over Ethernet
Fibre Channel over Ethernet (FCoE) is an encapsulation of Fibre Channel frames over Ethernet networks. This allows Fibre Channel to use 10 Gigabit Ethernet networks (or higher speeds) while preserving the Fibre Channel protocol.
MACsec IEEE 802.1 AE
802.1AE is the IEEE MAC Security (MACsec) standard which defines connectionless data confidentiality and integrity for media access independent protocols.
IEEE 1588, also knows as the Precision Time Protocol (PTP) is a protocol used to synchronize clocks throughout a computer network. On a local area network it achieves clock accuracy in the sub-microsecond range, making it suitable for measurement and control systems.
iWARP delivers converged, low-latency fabric services to data centers through Remote Direct Memory Access (RDMA) over Ethernet. The key iWARP components that deliver low-latency are Kernel Bypass, Direct Data Placement, and Transport Acceleration.
Intel® Data Direct I/O Technology
Intel® Data Direct I/O Technology is a platform technology that improves I/O data processing efficiency for data delivery and data consumption from I/O devices. With Intel DDIO, Intel® Server Adapters and controllers talk directly to the processor cache without a detour via system memory, reducing latency, increasing system I/O bandwidth, and reducing power consumption.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.