Intel® 82562EP Fast Ethernet PHY
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System Interface Type
NC Sideband Interface
Jumbo Frames Supported
Ordering and Compliance
Retired and discontinued
Trade compliance information
- ECCN 5A991
- CCATS NA
- US HTS 8542310001
- 862943 PCN
- 863061 PCN
Drivers and Software
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Latest Drivers & Software
Adapter User Guide for Intel® Ethernet Adapters
This download contains the 27.8 version of the Intel® Ethernet Adapter User Guide.View download options.
Administrative Tools for Intel® Network Adapters
This download record installs version 27.7 of the administrative tools for Intel® Network Adapters.View download options.
The date the product was first introduced.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Fiber Channel over Ethernet
Fibre Channel over Ethernet (FCoE) is an encapsulation of Fibre Channel frames over Ethernet networks. This allows Fibre Channel to use 10 Gigabit Ethernet networks (or higher speeds) while preserving the Fibre Channel protocol.
MACsec IEEE 802.1 AE
802.1AE is the IEEE MAC Security (MACsec) standard which defines connectionless data confidentiality and integrity for media access independent protocols.
IEEE 1588, also knows as the Precision Time Protocol (PTP) is a protocol used to synchronize clocks throughout a computer network. On a local area network it achieves clock accuracy in the sub-microsecond range, making it suitable for measurement and control systems.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.