Intel® 82574L Gigabit Ethernet Controller
Specifications
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Essentials
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Product Collection
Intel® 82574 Gigabit Ethernet Controller
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Code Name
Products formerly Hartwell
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Marketing Status
Discontinued
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Launch Date
Q2'08
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Expected Discontinuance
LOD 1/31/2021; LSD 7/31/2021
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Lithography
90 nm
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TDP
0.727 W
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Operating Temperature Range
0°C to 85°C
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Max Operating Temperature
85 °C
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Minimum Operating Temperature
0 °C
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Supplemental Information
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Datasheet
View now
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Description
See PCN 117376 for EOL Timelines
Networking Specifications
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Port Configuration
Single
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Data Rate Per Port
1GbE
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System Interface Type
PCIe v1.1 (2.5 GT/s)
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NC Sideband Interface
Yes
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Jumbo Frames Supported
Yes
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Interfaces Supported
100BASE-T, 1000BASE-T
Package Specifications
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Package Size
9mm x 9mm
Advanced Technologies
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MACsec IEEE 802.1 AE
No
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IEEE 1588
Yes
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Supported Under Intel vPro® Technology
No
Ordering and Compliance
Drivers and Software
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Latest Drivers & Software
Name
Intel® Ethernet Product Release Notes
Administrative Tools for Intel® Network Adapters
Adapter User Guide for Intel® Ethernet Adapters
Intel® Network Adapter Driver for Windows Server 2012*
Intel® Network Adapter Driver for Windows Server 2008 R2* - Final Release
Intel® Ethernet Adapter Drivers for MS-DOS* - FINAL RELEASE
Disabling TCP-IPv6 Checksum Offload Capability with Intel® 1/10 GbE Controllers
Intel® Network Adapter Driver for Windows 8* - Final Release
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Max Operating Temperature
This is the maximum operating temperature allowed as reported by temperature sensors. Instantaneous temperature may exceed this value for short durations. Note: Maximum observable temperature is configurable by system vendor and can be design specific.
MACsec IEEE 802.1 AE
802.1AE is the IEEE MAC Security (MACsec) standard which defines connectionless data confidentiality and integrity for media access independent protocols.
IEEE 1588
IEEE 1588, also knows as the Precision Time Protocol (PTP) is a protocol used to synchronize clocks throughout a computer network. On a local area network it achieves clock accuracy in the sub-microsecond range, making it suitable for measurement and control systems.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.