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  • Brand Name: Core Ultra

  • Product Number: 6526Y

  • Ordering Code: PK8072205559500

  • SPEC Code: SRN6N

  • Code Name: Emerald Rapids

Intel® 82Q35 Graphics and Memory Controller

Specifications

Export specifications

Essentials

Supplemental Information

GPU Specifications

Package Specifications

  • Max CPU Configuration 1
  • TCASE 106°C
  • Package Size 34mm x 34mm

Ordering and Compliance

Retired and discontinued

Intel® 82Q35 Graphics and Memory Controller Hub (GMCH)

  • MM# 891054
  • Spec Code SLAEX
  • Ordering Code LE82Q35
  • Stepping A2
  • MDDS Content IDs 707497, 707734

Intel® 82Q35 Graphics and Memory Controller Hub (GMCH)

  • MM# 915750
  • Spec Code SLJA7
  • Ordering Code LE82Q35
  • Stepping A5
  • MDDS Content IDs 707497, 707734

Trade compliance information

  • ECCN 4A994
  • CCATS NA
  • US HTS 8542310001

PCN Information

SLJA7

SLAEX

Compatible Products

Legacy Intel® Core™ Processors

Product Name Launch Date Total Cores Cache Sort Order Compare
All | None
Intel® Core™2 Quad Processor Q9650 Q3'08 4 12 MB L2 Cache 11716
Intel® Core™2 Quad Processor Q9550S Q1'09 4 12 MB L2 Cache 11744
Intel® Core™2 Quad Processor Q9550 Q1'08 4 12 MB L2 Cache 11749
Intel® Core™2 Quad Processor Q9450 Q1'08 4 12 MB L2 Cache 11797
Intel® Core™2 Quad Processor Q9400S Q1'09 4 6 MB L2 Cache 11823
Intel® Core™2 Quad Processor Q9400 Q3'08 4 6 MB L2 Cache 11837
Intel® Core™2 Quad Processor Q9300 Q1'08 4 6 MB L2 Cache 11855

Legacy Intel® Celeron® Processor

Product Name Launch Date Total Cores Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Celeron® Processor 450 Q3'08 1 2.20 GHz 512 KB L2 Cache 35 W 23354
Intel® Celeron® Processor 440 Q3'06 1 2.00 GHz 512 KB L2 Cache 35 W 23361
Intel® Celeron® Processor 430 Q2'07 1 1.80 GHz 512 KB L2 Cache 35 W 23379
Intel® Celeron® Processor 420 Q2'07 1 1.60 GHz 512 KB L2 Cache 35 W 23392

Drivers and Software

Latest Drivers & Software

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Launch Date

The date the product was first introduced.

Supported FSBs

FSB (Front Side Bus) is the interconnect between the processor and the Memory Controller Hub (MCH).

FSB Parity

FSB parity provides error checking on data sent on the FSB (Front Side Bus).

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Use Conditions

Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

Physical Address Extensions

Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

Intel® Clear Video Technology

Intel® Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations ‡

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.

TCASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Fast Memory Access

Intel® Fast Memory Access is an updated Graphics Memory Controller Hub (GMCH) backbone architecture that improves system performance by optimizing the use of available memory bandwidth and reducing the latency of the memory accesses.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.