Intel® Xeon® Processor E5335
Specifications
Compare Intel® Products
Essentials
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Product Collection
Legacy Intel® Xeon® Processors
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Code Name
Products formerly Clovertown
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Vertical Segment
Server
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Processor Number
E5335
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Lithography
65 nm
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Performance Specifications
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Total Cores
4
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Processor Base Frequency
2.00 GHz
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Cache
8 MB L2 Cache
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Bus Speed
1333 MHz
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FSB Parity
Yes
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TDP
80 W
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VID Voltage Range
1.0000V-1.5000V
Supplemental Information
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Marketing Status
Discontinued
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Launch Date
Q1'07
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Servicing Status
End of Servicing Lifetime
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Embedded Options Available
Yes
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Datasheet
View now
Package Specifications
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Sockets Supported
LGA771,PLGA771
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TCASE
66°C
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Package Size
37.5mm x 37.5mm
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Processing Die Size
286 mm2
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# of Processing Die Transistors
582 million
Advanced Technologies
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Intel® Turbo Boost Technology ‡
No
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Intel® Hyper-Threading Technology ‡
No
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Intel® Virtualization Technology (VT-x) ‡
Yes
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Intel® VT-x with Extended Page Tables (EPT) ‡
No
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Intel® 64 ‡
Yes
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Instruction Set
64-bit
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Idle States
Yes
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Enhanced Intel SpeedStep® Technology
Yes
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Intel® Demand Based Switching
No
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Thermal Monitoring Technologies
Yes
Security & Reliability
Ordering and Compliance
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Retired and discontinued
Boxed Intel® Xeon® Processor E5335 (8M Cache, 2.00 GHz, 1333 MHz FSB) FC-LGA6
- MM# 887230
- Spec Code SL9YK
- Ordering Code BX80563E5335A
- Shipping Media BOX
- Stepping B3
- MDDS Content IDs 802710, 803591, 803906, 807136, 807841, 809434, 809758
- PCN Content IDs 807136, 802710, 803591, 803906, 807841, 809434, 809758
Boxed Intel® Xeon® Processor E5335 (8M Cache, 2.00 GHz, 1333 MHz FSB) Passive, FC-LGA6
- MM# 887232
- Spec Code SL9YK
- Ordering Code BX80563E5335P
- Shipping Media BOX
- Stepping B3
- MDDS Content IDs 802710, 803591, 803906, 807136, 807841, 809434, 809758
- PCN Content IDs 802710, 803591, 803906, 807136, 809434, 807841, 809758
Intel® Xeon® Processor E5335 (8M Cache, 2.00 GHz, 1333 MHz FSB) FC-LGA6, Tray
- MM# 890663
- Spec Code SLAC7
- Ordering Code HH80563QJ0418M
- Shipping Media TRAY
- Stepping B3
- MDDS Content IDs 706294
- PCN Content IDs 799590, 801680, 803020, 803591, 804934, 806150, 807136, 809373, 811431, 813830, 795893, 804350, 805021, 807841, 809238, 810640, 813819, 813824
Boxed Intel® Xeon® Processor E5335 (8M Cache, 2.00 GHz, 1333 MHz FSB) FC-LGA6
- MM# 890826
- Spec Code SLAC7
- Ordering Code BX80563E5335A
- Shipping Media BOX
- Stepping B3
- MDDS Content IDs 802710, 803591, 803906, 807136, 807841, 809434, 809758
- PCN Content IDs 809434, 802710, 803591, 803906, 807136, 807841, 809758
Boxed Intel® Xeon® Processor E5335 (8M Cache, 2.00 GHz, 1333 MHz FSB) Passive, FC-LGA6
- MM# 890827
- Spec Code SLAC7
- Ordering Code BX80563E5335P
- Shipping Media BOX
- Stepping B3
- MDDS Content IDs 802710, 803591, 803906, 807136, 807841, 809434, 809758
- PCN Content IDs 803591, 809434, 802710, 803906, 807136, 807841, 809758
Intel® Xeon® Processor E5335 (8M Cache, 2.00 GHz, 1333 MHz FSB) FC-LGA6, Tray
- MM# 891116
- Spec Code SLAEK
- Ordering Code HH80563QJ0418M
- Shipping Media TRAY
- Stepping G0
- MDDS Content IDs 706294
- PCN Content IDs 795893, 801680, 803020, 804934, 806150, 807136, 807841, 809373, 810640, 811431, 813824, 799590, 803591, 804350, 805021, 809238, 813819, 813830
Boxed Intel® Xeon® Processor E5335 (8M Cache, 2.00 GHz, 1333 MHz FSB) FC-LGA6
- MM# 892329
- Spec Code SLAEK
- Ordering Code BX80563E5335A
- Shipping Media BOX
- Stepping G0
- MDDS Content IDs 802710, 803591, 803906, 807136, 807841, 809434, 809758
- PCN Content IDs 807841, 809434, 802710, 803591, 803906, 807136, 809758
Boxed Intel® Xeon® Processor E5335 (8M Cache, 2.00 GHz, 1333 MHz FSB) Passive, FC-LGA6
- MM# 892335
- Spec Code SLAEK
- Ordering Code BX80563E5335P
- Shipping Media BOX
- Stepping G0
- MDDS Content IDs 802710, 803591, 803906, 807136, 807841, 809434, 809758
- PCN Content IDs 809434, 802710, 803591, 803906, 807136, 807841, 809758
Trade compliance information
- ECCN 3A991.A.1
- CCATS NA
- US HTS 8542310001
Compatible Products
Intel® Server Board S5000PA Family
Intel® Server Board S5000PAL Family
Intel® Server Board S5000PSL Family
Intel® Server Board S5000VSA Family
Intel® Workstation Board S5000XVN Family
Intel® Server System SR1500AL Family
Intel® Server System SR1530CL Family
Intel® Server System SR1550AL Family
Intel® Server System SR2500AL Family
Intel® Server System SR1000HC Family
Drivers and Software
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Processor Number
The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
For more details regarding the dynamic power and frequency operating range, refer to
Cache
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
Bus Speed
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
FSB Parity
FSB parity provides error checking on data sent on the FSB (Front Side Bus).
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
VID Voltage Range
VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.
Launch Date
The date the product was first introduced.
Servicing Status
Intel Servicing provides functional and security updates for Intel processors or platforms, typically utilizing the Intel Platform Update (IPU).
See "Changes in Customer Support and Servicing Updates for Select Intel® Processors" for more information on servicing.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Sockets Supported
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
TCASE
Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).
Intel® Turbo Boost Technology ‡
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® Hyper-Threading Technology ‡
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® VT-x with Extended Page Tables (EPT) ‡
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel® 64 ‡
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Intel® Demand Based Switching
Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Execute Disable Bit ‡
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Boxed Processor
Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.
Boxed Processor
Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.
Tray Processor
Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.
Boxed Processor
Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.
Boxed Processor
Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.
Tray Processor
Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.
Boxed Processor
Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.
Boxed Processor
Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.
See http://www.intel.com/content/www/us/en/architecture-and-technology/hyper-threading/hyper-threading-technology.html?wapkw=hyper+threading for more information including details on which processors support Intel® HT Technology.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information and applicability of this technology.
Processors that support 64-bit computing on Intel® architecture require an Intel 64 architecture-enabled BIOS.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.