Intel® Pentium® 4 Processor 2.66 GHz, 1M Cache, 533 MHz FSB

Specifications

Performance Specifications

Supplemental Information

Package Specifications

  • Sockets Supported PPGA478
  • TCASE 73.1°C
  • Processing Die Size 112 mm2
  • # of Processing Die Transistors 125 million

Ordering and Compliance

Retired and discontinued

Intel® Pentium® 4 Processor 2.66 GHz, 1M Cache, 533 MHz FSB, mPGA 478, Tray

  • MM# 859181
  • Spec Code SL7E9
  • Ordering Code RK80546PE0671M
  • Shipping Media TRAY
  • Stepping C1
  • MDDS Content IDs 707537

Boxed Intel® Pentium® 4 Processor 2.66 GHz, 1M Cache, 533 MHz FSB, mPGA 478

  • MM# 861589
  • Spec Code SL7E9
  • Ordering Code BX80546PE2667E
  • Shipping Media BOX
  • Stepping C1
  • MDDS Content IDs 708471

Intel® Pentium® 4 Processor 2.66 GHz, 1M Cache, 533 MHz FSB, mPGA 478, Tray

  • MM# 868714
  • Spec Code SL8B3
  • Ordering Code RK80546PE0671M
  • Shipping Media TRAY
  • Stepping E0
  • MDDS Content IDs 707537

Boxed Intel® Pentium® 4 Processor 2.66 GHz, 1M Cache, 533 MHz FSB, mPGA 478

  • MM# 869504
  • Spec Code SL8B3
  • Ordering Code BX80546PE2667E
  • Shipping Media BOX
  • Stepping E0
  • MDDS Content IDs 708471

PCN Information

SL8B3

SL7E9

Drivers and Software

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Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

For more details regarding the dynamic power and frequency operating range, refer to

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

VID Voltage Range

VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Servicing Status

Intel Servicing provides functional and security updates for Intel processors or platforms, typically utilizing the Intel Platform Update (IPU).

See "Changes in Customer Support and Servicing Updates for Select Intel® Processors" for more information on servicing.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TCASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.

Boxed Processor

Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.

Boxed Processor

Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.