Intel® Celeron® D Processor 356

Intel® Celeron® D Processor 356

512K Cache, 3.33 GHz, 533 MHz FSB

Specifications

Performance

Supplemental Information

Memory Specifications

Package Specifications

  • Sockets Supported PLGA775
  • TCASE C1=69.2°C; D0=64.4°C
  • Package Size 37.5mm x 37.5mm
  • Processing Die Size 81 mm2
  • # of Processing Die Transistors 188 million
  • Low Halogen Options Available No

Ordering and Compliance

Retired and discontinued

Intel® Celeron® D Processor 356 (512K Cache, 3.33 GHz, 533 MHz FSB) LGA775, Tray

  • MM# 882917
  • Spec Code SL9KL
  • Ordering Code HH80552RE093512
  • Shipping Media TRAY
  • Stepping D0

Boxed Intel® Celeron® D Processor 356 (512K Cache, 3.33 GHz, 533 MHz FSB) LGA775

  • MM# 879371
  • Spec Code SL96N
  • Ordering Code BX80552356
  • Shipping Media BOX
  • Stepping C1

Boxed Intel® Celeron® D Processor 356 (512K Cache, 3.33 GHz, 533 MHz FSB) LGA775

  • MM# 884469
  • Spec Code SL9KL
  • Ordering Code BX80552356
  • Shipping Media BOX
  • Stepping D0

Intel® Celeron® D Processor 356 (512K Cache, 3.33 GHz, 533 MHz FSB) LGA775, Tray

  • MM# 878873
  • Spec Code SL96N
  • Ordering Code HH80552RE093512
  • Shipping Media TRAY
  • Stepping C1

Trade compliance information

  • ECCN 3A991.A.1
  • CCATS NA
  • US HTS 8542310001

PCN/MDDS Information

SL9KL

SL96N

Compatible products

Find Compatible Desktop Boards

Find boards compatible with the Intel® Celeron® D Processor 356 in the Intel Desktop Compatibility Tool

Intel® 960 Series Chipsets

Product Name Status Embedded Options Available TDP Recommended Customer Price SortOrder Compare
All | None
Intel® 82G965 Graphics and Memory Controller Launched No 28 W
Intel® 82Q963 Graphics and Memory Controller Launched No 28 W
Intel® 82Q965 Graphics and Memory Controller Launched Yes 28 W
Intel® 82P965 Memory Controller Launched No 19 W

Intel® 940 Series Chipsets

Product Name Status Embedded Options Available TDP Recommended Customer Price SortOrder Compare
All | None
Intel® 82946GZ Graphics and Memory Controller Launched No 26 W
Intel® 82945GC Graphics and Memory Controller Launched Yes 22.2 W
Intel® 82946PL Memory Controller Launched No 16 W
Intel® 82945G Memory Controller Launched Yes 22.2 W
Intel® 82945GZ Memory Controller Launched No 22.2 W
Intel® 82945P Memory Controller Launched No 15.2 W
Intel® 82945PL Memory Controller Launched No 15.2 W

Intel® 910 Series Chipsets

Product Name Status Embedded Options Available TDP Recommended Customer Price SortOrder Compare
All | None
Intel® 915GV Graphics and Memory Controller Launched Yes 16.3 W
Intel® 82915GL Graphics and Memory Controller Launched No 16.3 W

Downloads and Software

Launch Date

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

FSB Parity

FSB parity provides error checking on data sent on the FSB (Front Side Bus).

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

VID Voltage Range

VID Voltage Range is an indicator of the minimum and maximum voltage values at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Physical Address Extensions

Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TCASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Turbo Boost Technology

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® 64

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Intel® Demand Based Switching

Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.

Boxed Processor

Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.

Boxed Processor

Intel Authorized Distributors sell Intel processors in clearly marked boxes from Intel. We refer to these processors as boxed processors. They typically carry a three-year warranty.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.