Intel® IPU Adapter E2100- CCQDA2HL
Specifications
Compare Intel® Products
Essentials
-
Product Collection
200GbE Intel® Infrastructure Processing Unit E2100
-
Marketing Status
Launched
-
Launch Date
Q4'24
-
Vertical Segment
Server
-
Cable Medium
Copper, Optics
-
Cabling Type
QSFP56 ports - DAC, Optics, and AOC's
-
Bracket Height
full height
-
TDP
75 W
-
Ethernet Controller
200GbE Intel® Infrastructure Processing Unit E2100
-
Supported Operating Systems
Linux*
-
Use Conditions
Server/Enterprise
Sign in with your CNDA account to view additional SKU details.
Networking Specifications
-
Port Configuration
Dual
-
Data Rate Per Port
200/100/50/25/10GbE
-
Intel® Virtualization Technology for Connectivity (VT-c)
No
Package Specifications
-
System Interface Type
PCIe 4.0 (16GT/s)
-
Board Form Factor
½ length, full height, single slot
Intel® Virtualization Technology for Connectivity
-
On-chip QoS and Traffic Management
No
-
Virtual Machine Device Queues (VMDq)
Yes
-
PCI-SIG* SR-IOV Capable
Yes
Advanced Technologies
-
iWARP/RDMA
No
-
RoCEv2/RDMA
Yes
-
Intel® Data Direct I/O Technology
No
-
Intelligent Offloads
Yes
-
Storage Over Ethernet
Yes
Ordering and Compliance
Drivers and Software
Description
Type
More
OS
Version
Date
All
View Details
Download
No results found for
Y
/apps/intel/arksuite/template/arkProductPageTemplate
Latest Drivers & Software
Launch Date
The date the product was first introduced.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Use Conditions
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
Virtual Machine Device Queues (VMDq)
Virtual Machine Device Queues (VMDq) is a technology designed to offload some of the switching done in the VMM (Virtual Machine Monitor) to networking hardware specifically designed for this function. VMDq drastically reduces overhead associated with I/O switching in the VMM which greatly improves throughput and overall system performance
PCI-SIG* SR-IOV Capable
Single-Root I/O Virtualization (SR-IOV) involves natively (directly) sharing a single I/O resource between multiple virtual machines. SR-IOV provides a mechanism by which a Single Root Function (for example a single Ethernet Port) can appear to be multiple separate physical devices.
iWARP/RDMA
iWARP delivers converged, low-latency fabric services to data centers through Remote Direct Memory Access (RDMA) over Ethernet. The key iWARP components that deliver low-latency are Kernel Bypass, Direct Data Placement, and Transport Acceleration.
RoCEv2/RDMA
RoCEv2/RDMA (Remote Direct Memory Access over Converged Ethernet v2) delivers converged, low-latency fabric services to data centers through RDMA over UDP/IP. UDP/IP (User Datagram Protocol) is a communication protocol used for time-sensitive transmissions such as video or voice that speeds up communications by not requiring a “handshake” from the receiving party.
Intel® Data Direct I/O Technology
Intel® Data Direct I/O Technology is a platform technology that improves I/O data processing efficiency for data delivery and data consumption from I/O devices. With Intel DDIO, Intel® Server Adapters and controllers talk directly to the processor cache without a detour via system memory, reducing latency, increasing system I/O bandwidth, and reducing power consumption.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.