Intel Atom® x7405C Processor
Specifications
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Essentials
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Product Collection
Intel Atom® Processor X Series
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Code Name
Products formerly Amston Lake
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Vertical Segment
Embedded
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Processor Number
X7405C
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Lithography
Intel 7
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CPU Specifications
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Total Cores
4
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Max Turbo Frequency
3.4 GHz
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Cache
6 MB
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TDP
12 W
Supplemental Information
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Marketing Status
Launched
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Launch Date
Q2'24
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Embedded Options Available
Yes
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Use Conditions
Communications Commercial Temp, Embedded Broad Market Commercial Temp
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Extended Temperature Options
No
Memory Specifications
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Max Memory Size (dependent on memory type)
32 GB
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Memory Types
DDR4 3200 MT/s
DDR5 4800 MT/s
LPDDR5 4800 MT/s
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Maximum Memory Speed
4800 MHz
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Max # of Memory Channels
1
Expansion Options
I/O Specifications
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USB Revision
2.0/3.2
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General Purpose IO
Yes
Package Specifications
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Sockets Supported
FCBGA1264
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Max CPU Configuration
1
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TJUNCTION
105°C
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Package Size
35mm x 24mm
Advanced Technologies
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Intel® Time Coordinated Computing (Intel® TCC)‡
Yes
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Intel® Gaussian & Neural Accelerator
3.0
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Intel® Smart Sound Technology
Yes
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Intel® Wake on Voice
Yes
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Intel® High Definition Audio
Yes
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Intel® Speed Shift Technology
Yes
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Intel® Hyper-Threading Technology ‡
No
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Instruction Set
64-bit
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Instruction Set Extensions
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
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Enhanced Intel SpeedStep® Technology
Yes
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Thermal Monitoring Technologies
Yes
Security & Reliability
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Intel® AES New Instructions
Yes
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Intel® Trusted Execution Technology ‡
No
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Intel® OS Guard
Yes
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Intel® Boot Guard
Yes
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Mode-based Execute Control (MBEC)
Yes
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Intel® Virtualization Technology (VT-x) ‡
Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
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Intel® VT-x with Extended Page Tables (EPT) ‡
Yes
Ordering and Compliance
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Ordering and spec information
Trade compliance information
- ECCN 5A992C
- CCATS G167599
- US HTS 8542310050
Drivers and Software
Description
Type
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OS
Version
Date
All
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Latest Drivers & Software
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Processor Number
The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Max Turbo Frequency
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.
Cache
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Launch Date
The date the product was first introduced.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Use Conditions
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Chipset / PCH PCIe Revision
Chipset/PCH PCIe Revision is the version supported by the PCH for the PCIe lanes directly attached to the PCH. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCIe Express version support different data rates.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Sockets Supported
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
TJUNCTION
Junction Temperature is the maximum temperature allowed at the processor die.
Intel® Time Coordinated Computing (Intel® TCC)‡
Intel® Time Coordinated Computing (Intel® TCC)-enabled processors deliver optimal compute and time performance for real-time applications. Using integrated or discrete Ethernet controllers featuring IEEE 802.1 Time Sensitive Networking (TSN), these processors can power complex real-time systems. Read more about Real-Time Computing.
Intel® Gaussian & Neural Accelerator
Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speech-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.
Intel® Smart Sound Technology
Intel® Smart Sound Technology is an integrated audio DSP (Digital Signal Processor) built to handle audio, voice, and speech interaction. It allows the latest Intel® Core™ processor-based PCs to respond to your voice command quickly and offer high fidelity audio without impact system performance and battery life.
Intel® Wake on Voice
Intel® Wake on Voice allows your device to wait and listen for your command without consuming excessive power and battery life, as well as wake from modern standby.
Intel® High Definition Audio
Audio interface for codecs to communicate with Intel SoCs and chipsets.
Intel® Speed Shift Technology
Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.
Intel® Hyper-Threading Technology ‡
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Enhanced Intel SpeedStep® Technology
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Intel® Boot Guard
Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.
Mode-based Execute Control (MBEC)
Mode-based Execute Control can more reliably verify and enforce the integrity of kernel level code.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® VT-x with Extended Page Tables (EPT) ‡
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Tray Processor
Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.
See http://www.intel.com/content/www/us/en/architecture-and-technology/hyper-threading/hyper-threading-technology.html?wapkw=hyper+threading for more information including details on which processors support Intel® HT Technology.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.