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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Data Center GPU Max 1550

Specifications

Export specifications

Essentials

GPU Specifications

  • Xe-cores 128
  • Ray Tracing Units 128
  • Intel® Xe Matrix Extensions (Intel® XMX) Engines 1024
  • Xe Vector Engines 1024
  • Graphics Max Dynamic Clock 1600 MHz
  • Graphics Base Clock 900 MHz
  • Intel® Xe Link Maximum Frequency 53 Gbps
  • TDP 600 W
  • PCI Express Configurations ‡ Gen 5 x16
  • Device ID 0x0BD5

Memory Specifications

  • Memory Size 128 GB
  • Memory Type HBM2e
  • Graphics Memory Interface 1024 bit
  • Graphics Memory Bandwidth 3276.8 GB/s

Supported Technologies

I/O Specifications

  • # of Displays Supported‡ 0

Features

  • H.264 Hardware Encode/Decode No

Ordering and Compliance

Ordering and spec information

Intel® Data Center GPU Max 1550

  • MM# 99C7PL
  • Ordering Code A4OP1W20802

Trade compliance information

  • ECCN 5A992CRS
  • CCATS G157815L2
  • US HTS 8473301180

Drivers and Software

Latest Drivers & Software

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Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Warranty Period

Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.

Use Conditions

Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

PCI Express Configurations ‡

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.

oneAPI Support

oneAPI is an open, cross-industry, standards-based, unified, multiarchitecture, multi-vendor programming model that delivers a common developer experience across accelerator architectures – for faster application performance, more productivity, and greater innovation. The oneAPI initiative encourages collaboration on the oneAPI specification and compatible oneAPI implementations across the ecosystem.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.