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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® HM770 Chipset

Specifications

Export specifications

Essentials

Supplemental Information

Processor Graphics

  • # of Displays Supported ‡ 4

Expansion Options

I/O Specifications

Package Specifications

  • Package Size 28mm x 25mm

Ordering and Compliance

Ordering and spec information

Intel® HM770 Platform Controller Hub

  • MM# 99C36D
  • Spec Code SRM8M
  • Ordering Code FH82HM770
  • Stepping B1

Trade compliance information

  • ECCN 5A992CN3
  • CCATS G158870
  • US HTS 8542310001

Compatible Products

13th Generation Intel® Core™ i9 Processors

Product Name Marketing Status Launch Date Total Cores Max Turbo Frequency Cache Processor Graphics ‡ Sort Order Compare
All | None
Intel® Core™ i9-13980HX Processor Launched Q1'23 24 5.60 GHz 36 MB Intel® Smart Cache Intel® UHD Graphics for 13th Gen Intel® Processors 7186
Intel® Core™ i9-13950HX Processor Launched Q1'23 24 5.50 GHz 36 MB Intel® Smart Cache Intel® UHD Graphics for 13th Gen Intel® Processors 7188
Intel® Core™ i9-13900HX Processor Launched Q1'23 24 5.40 GHz 36 MB Intel® Smart Cache Intel® UHD Graphics for 13th Gen Intel® Processors 7190

13th Generation Intel® Core™ i7 Processors

Compare
All | None

13th Generation Intel® Core™ i5 Processors

Product Name Marketing Status Launch Date Total Cores Max Turbo Frequency Cache Processor Graphics ‡ Sort Order Compare
All | None
Intel® Core™ i5-13600HX Processor Launched Q1'23 14 4.80 GHz 24 MB Intel® Smart Cache Intel® UHD Graphics for 13th Gen Intel® Processors 7298
Intel® Core™ i5-13500HX Processor Launched Q1'23 14 4.70 GHz 24 MB Intel® Smart Cache Intel® UHD Graphics for 13th Gen Intel® Processors 7319
Intel® Core™ i5-13450HX Processor Launched Q1'23 10 4.60 GHz 20 MB Intel® Smart Cache Intel® UHD Graphics for 13th Gen Intel® Processors 7335

Drivers and Software

Latest Drivers & Software

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Launch Date

The date the product was first introduced.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Supports Overclocking

Overclocking indicates the ability to achieve high core, graphics and memory frequencies by independently raising processor clock speeds without impacting other system components.

Use Conditions

Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

# of DIMMs per channel

DIMMs per Channel indicates the quantity of dual inline memory modules supported per each processor memory channel

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Supports Memory Overclocking

Overclocking indicates the ability to achieve higher core, graphics and memory frequencies by independently altering clock frequency or voltage without impacting other system components.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations ‡

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Supported Processor PCI Express Port Configurations

Configurations indicates the number of lanes and bifurcation capabilities for which the processor PCI express port is enabled. Note: The processor's actual PCI express configurations will be determined or limited by the value of this chipset attribute even if the processor is capable of additional configurations.

Intel® ME Firmware Version

Intel® Management Engine Firmware (Intel® ME FW) uses built-in platform capabilities and management and security applications to remotely manage networked computing assets out-of-band.

Intel® HD Audio Technology

Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.

Intel® Rapid Storage Technology

Intel® Rapid Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Successor to Intel® Matrix Storage Technology.

Intel® Stable IT Platform Program (SIPP)

The Intel® Stable IT Platform Program (Intel® SIPP) aims for zero changes to key platform components and drivers for at least 15 months or until the next generational release, reducing complexity for IT to effectively manage their computing endpoints.
Learn more about Intel® SIPP

Intel® Rapid Start Technology

Intel® Rapid Start Technology allows quick system resumes from the hibernate state.

Intel® Rapid Storage Technology for PCI Storage

Enables Intel® Rapid Storage Technology features to operate on PCI Storage devices, providing protection, performance, and expandability for the platform.

Intel® Smart Sound Technology

Intel® Smart Sound Technology is an integrated digital signal processor (DSP) for audio offload and audio/voice features

Intel® Platform Trust Technology (Intel® PTT)

Intel® Platform Trust Technology (Intel® PTT) is a platform functionality for credential storage and key management used by Windows 8* and Windows® 10. Intel® PTT supports BitLocker* for hard drive encryption and supports all Microsoft requirements for firmware Trusted Platform Module (fTPM) 2.0.

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Intel® Boot Guard

Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

Unlocked features are present with select chipsets and processor combinations. Altering clock frequency or voltage may damage or reduce the useful life of the processor and other system components, and may reduce system stability and performance. Product warranties may not apply if the processor is operated beyond its specifications. Check with the manufacturers of system and components for additional details.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

Intel® Rapid Start Technology requires a select Intel® processor, Intel® software and BIOS update, and a Solid-State Drive (SSD) or hybrid drive. Depending on system configuration, your results may vary. Contact your system manufacturer for more information.

WARNING: Altering clock frequency and/or voltage may: (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. Intel assumes no responsibility that the processor, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. For more information, visit http://www.intel.com/content/www/us/en/gaming/overclocking/overclocking-intel-processors.html

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.