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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Server Chassis FC2FAC27W0 Full-Width Configuration Air-Cooled No PSUs

Specifications

Export specifications

Essentials

  • Product Collection Intel® Server Chassis FC2000 Family
  • Code Name Products formerly Optimus Beach
  • Launch Date Q1'23
  • Marketing Status Launched
  • Expected Discontinuance 2023
  • EOL Announce Friday, May 5, 2023
  • Last Order Friday, June 30, 2023
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • Chassis Form Factor 2U Rack front IO
  • Chassis Dimensions 865 x 441.8 x 86.8 mm (L x W x H)
  • Target Market High Performance Computing, Scalable Performance
  • Power Supply 2700 W
  • Power Supply Type AC
  • # of Power Supply Included 0
  • Redundant Fans Yes
  • Redundant Power Supported Yes
  • TDP 350 W
  • Included Items (1) – 2U chassis FC2000
    (4) – Air-cooled fan assembly with integrated dual rotor 60mm fan – iPC FCXX60MMACFAN
    (2) – Air-cooled fan assembly with integrated dual rotor 40mm fan – iPC FCXX40MMACFAN
    (1) – Power distribution board assembly – iPC FCXXPDBASSMBL2
    (1) – Tool less rack rail mount kit – iPC FCXXRAILKIT
    (1) – EMP module filler

Supplemental Information

  • Description Intel® Server Chassis FC2000 v2 supporting 2U PCIe* Accelerator Module . No PSUs included

Ordering and Compliance

Retired and discontinued

Intel® Server Chassis FC2FAC27W0 Full-Width Configuration Air-Cooled No PSUs, Single

  • MM# 99ARXZ
  • Ordering Code FC2FAC27W0
  • MDDS Content IDs 707039

Trade compliance information

  • ECCN EAR99
  • CCATS NA
  • US HTS 8473305100

PCN Information

Compatible Products

Intel® Server D50DNP Family

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All | None

Management Module Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
EMP Module AXXFCEMP Q3'19 Launched 64405

Power Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
2700W Air-Cooled Power Supply FCXX27CRPSAC (FC2000 Family) Q1'23 Launched 64462
Air-Cooled Power Supply Blank Filler FCXXBLANKAC (FC2000 Family) Q1'23 Launched 64489
Power Distribution Board FCXXPDBASSMBL2 Q1'23 Launched 64495

Rail Options

Product Name Launch Date Marketing Status Sort Order Compare
All | None
2U Chassis Fixed External Rail Kit FCXXRAILKIT Q3'19 Launched 64515

Spare Fan Options

Compare
All | None

Drivers and Software

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Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.