Intel® Server Chassis FC2FAC27W0 Full-Width Configuration Air-Cooled No PSUs
Specifications
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Essentials
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Product Collection
Intel® Server Chassis FC2000 Family
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Code Name
Products formerly Optimus Beach
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Launch Date
Q1'23
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Marketing Status
Discontinued
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Expected Discontinuance
2023
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EOL Announce
Friday, May 5, 2023
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Last Order
Friday, June 30, 2023
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Limited 3-year Warranty
Yes
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Extended Warranty Available for Purchase (Select Countries)
Yes
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Chassis Form Factor
2U Rack front IO
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Chassis Dimensions
865 x 441.8 x 86.8 mm (L x W x H)
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Target Market
High Performance Computing, Scalable Performance
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Power Supply
2700 W
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Power Supply Type
AC
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# of Power Supply Included
0
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Redundant Fans
Yes
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Redundant Power Supported
Yes
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TDP
350 W
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Included Items
(1) – 2U chassis FC2000
(4) – Air-cooled fan assembly with integrated dual rotor 60mm fan – iPC FCXX60MMACFAN
(2) – Air-cooled fan assembly with integrated dual rotor 40mm fan – iPC FCXX40MMACFAN
(1) – Power distribution board assembly – iPC FCXXPDBASSMBL2
(1) – Tool less rack rail mount kit – iPC FCXXRAILKIT
(1) – EMP module filler
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Supplemental Information
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Description
Intel® Server Chassis FC2000 v2 supporting 2U PCIe* Accelerator Module . No PSUs included
Ordering and Compliance
Compatible Products
Intel® Server D50DNP Family
Management Module Options
Power Options
Rail Options
Spare Fan Options
Drivers and Software
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Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.