Intel® Server Chassis FC2HAC27W0 Half-Width Configuration Air-Cooled No PSUs
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Intel® Server Chassis FC2000 Family
Products formerly Optimus Beach
Friday, May 5, 2023
Friday, June 30, 2023
Limited 3-year Warranty
Extended Warranty Available for Purchase (Select Countries)
Chassis Form Factor
2U Front IO, 4 node Rack
865 x 441.8 x 86.8 mm (L x W x H)
High Performance Computing, Scalable Performance
Power Supply Type
# of Power Supply Included
Redundant Power Supported
(1) – 2U chassis FC2000
(4) – Air-cooled fan assembly with integrated dual rotor 60mm fan – iPC FCXX60MMACFAN
(2) – Air-cooled fan assembly with integrated dual rotor 40mm fan – iPC FCXX40MMACFAN
(1) – Power distribution board assembly – iPC FCXXPDBASSMBL2
(1) – Tool less rack rail mount kit – iPC FCXXRAILKIT
(4) – Internal rail kit – iPC FCXX1USPPRT
(1) – EMP module filler
Intel® Server Chassis FC2000 v2 for half-width air-cooled modules. No PSUs included
Ordering and Compliance
Intel® Server D50DNP Family
Management Module Options
Spare Chassis Maintenance Options
Spare Fan Options
Drivers and Software
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The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
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Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.