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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Data Center GPU Flex 170

Specifications

Export specifications

Essentials

GPU Specifications

Memory Specifications

  • Memory Size 16 GB
  • Memory Type GDDR6
  • Graphics Memory Interface 256 bit
  • Graphics Memory Bandwidth 576 GB/s

Supported Technologies

  • Ray Tracing Yes

I/O Specifications

  • # of Displays Supported‡ 0

Features

  • H.264 Hardware Encode/Decode Yes
  • H.265 (HEVC) Hardware Encode/Decode Yes
  • AV1 Encode/Decode Yes
  • VP9 Bitstream & Decoding Yes

Ordering and Compliance

Ordering and spec information

Intel® Data Center GPU Flex 170

  • MM# 99AK03
  • Ordering Code 24P01G00BA
  • MDDS Content IDs 762208

Trade compliance information

  • ECCN 5A992C
  • CCATS G157815L2
  • US HTS 8473301180

PCN Information

Drivers and Software

Latest Drivers & Software

Downloads Available:
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Name

Intel® Data Center GPU Flex Series - Windows*

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Support

Launch Date

The date the product was first introduced.

Warranty Period

Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.

Use Conditions

Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

TBP

Total Board Power (TBP) represents the total power draw of a graphics card or other add-in card in watts, when it is operating under a typical load such as a gaming workload. The TBP value corresponds to Intel’s reference design. Intel’s partners may choose to productize Intel-based solutions with higher TBP values.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

PCI Express Configurations ‡

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.