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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® NUC 13 Extreme Compute Element - NUC13SBBi5

Specifications

Export specifications

Essentials

Supplemental Information

Processor Graphics

Expansion Options

I/O Specifications

  • # of USB Ports 11
  • USB Configuration Rear: 6x USB 3.2 Gen2, 2x TB4 (USB4); Headers: USB 3.2 Gen1 19-pin, USB 3.2 Gen2x2 Type-C Key A
  • USB Revision 3.2 Gen1, Gen2, Gen2x2, USB4
  • Total # of SATA Ports 2
  • Max # of SATA 6.0 Gb/s Ports 2
  • RAID Configuration RAID-0 or RAID-1
  • Audio (back channel + front channel) (R) 7.1 digital, 3x 3.5mm
  • Integrated LAN 10GbE (AQC113) + Intel® i226-V
  • Integrated Wireless‡ Intel® Killer(tm) Wi-Fi 6E AX1690 (i/s)
  • Integrated Bluetooth Yes
  • Additional Headers FRONT_PANEL
  • # of Thunderbolt™ Ports 2x Thunderbolt™ 4

Package Specifications

  • Chassis Dimensions 305 x 137 x 47mm

Security & Reliability

Drivers and Software

Latest Drivers & Software

Downloads Available:
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Name

Intel® Ethernet (LAN) Network Driver for Windows 11* for Intel® NUC 13 Extreme Kit - NUC13RNG/Intel® NUC Extreme Compute Element - NUC13SBB

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Intel® Thunderbolt™ 4 Driver for Windows 11* for Intel® NUC 13 Extreme Compute Element - NUC13SBB/Intel® NUC 13 Extreme Kits - NUC13RNG

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BIOS Update [SBRPL579]

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Intel® Graphics DCH Driver for Window 11* for the Intel® NUC 13 Extreme Kit - NUC13RNG/Intel® NUC Extreme Compute Element - NUC13SBB

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Intel® Wireless Technology-Based Driver for Windows® 10 & Windows* 11 for Intel® NUC Products

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Intel® Wireless Bluetooth Driver for Windows® 10 64-Bit and Windows 11* for Intel® NUC

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Intel® NUC Software Studio Service for Intel® NUC Products

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Intel® Chipset Device Software for Windows 11* for Intel® NUC 13 Extreme Kit - NUC13RNG/Intel® NUC Extreme Compute Element - NUC13SBB

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Intel® Management Engine Consumer Driver for Windows 11* for Intel® NUC 13 Extreme Kit - NUC13RNG/Intel® NUC Extreme Compute Element - NUC13SBB

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Intel® Serial IO Driver for Windows 11* for Intel® NUC 13 Extreme Kit - NUC13RNG/Intel® NUC Extreme Compute Element - NUC13SBB

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Intel® Killer™ Performance Suite for Windows 11* for Intel® NUC 13 Extreme Kit - NUC13RNG/Intel® NUC Extreme Compute Element - NUC13SBB

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Intel® Rapid Storage Technology for Intel® NUC Kit NUC13RNG & Intel® NUC Extreme Compute Element NUC13SBB Products When Using Windows 11*

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Intel® GNA Scoring Accelerator Driver for Windows 11* for Intel® NUC 13 Extreme Kit - NUC13RNG/Intel® NUC Extreme Compute Element - NUC13SBB

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PL2303 USB to UART Controller Driver for Windows 11* for Intel® NUC 13 Extreme Kit - NUC13RNG/Intel® NUC Extreme Compute Element - NUC13SBB

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Marvell AQtion* (LAN) Network Connection Driver for Windows 11* for Intel® NUC 13 Extreme Kit - NUC13RNG/Intel® NUC Extreme Compute Element - NUC13SBB

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ALC1220 Audio Driver for Windows 11* for Intel® NUC 13 Extreme Kit - NUC13RNG/Intel® NUC Extreme Compute Element - NUC13SBB

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ALC4050 Audio Driver for Windows 11* for Intel® NUC 13 Extreme Kit - NUC13RNG/Intel® NUC Extreme Compute Element - NUC13SBB

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Support

Launch Date

The date the product was first introduced.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Warranty Period

Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max # of DIMMs

DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations ‡

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.

M.2 Card Slot (wireless)

M.2 Card Slot (wireless) indicates presence of an M.2 slot that's keyed for wireless expansion cards

M.2 Card Slot (storage)

M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Additional Headers

Additional Headers indicates presence of additional interfaces such as NFC, auxiliary power, and others.

# of Thunderbolt™ Ports

Thunderbolt™ is a very high-speed, daisy-chainable interface that allows connection of multiple peripherals and displays to a computer. Thunderbolt™ 3 (40Gbps) uses a USB Type-C™ connector which combines PCI Express (PCIe Gen3), DisplayPort (DP 1.2), USB 3.1 Gen2 and provides up to 100W of DC power, all in one cable.

Intel® Optane™ Memory Supported ‡

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Rapid Storage Technology

Intel® Rapid Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Successor to Intel® Matrix Storage Technology.

Intel® Virtualization Technology (VT-x) ‡

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® Platform Trust Technology (Intel® PTT)

Intel® Platform Trust Technology (Intel® PTT) is a platform functionality for credential storage and key management used by Windows 8* and Windows® 10. Intel® PTT supports BitLocker* for hard drive encryption and supports all Microsoft requirements for firmware Trusted Platform Module (fTPM) 2.0.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.