Intel® NUC X15 Laptop Kit - LAPAC71H

Specifications

Supplemental Information

CPU Specifications

I/O Specifications

Package Specifications

  • TDP 45 W
  • Chassis Dimensions 358.3mm x 235mm x 22.2mm

Ordering and Compliance

Retired and discontinued

Bulk Intel® NUC X15 Laptop Kit, BAC71HBBU6000, w/Intel® Core™ i7, DG2 SKU2, Black, FHD144, US ANSI Keyboard, w/ No cord L6, 5 pack

  • MM# 99C2JP
  • Ordering Code BAC71HBBU6000
  • MDDS Content IDs 751294

Trade compliance information

  • ECCN 5A992C
  • CCATS G157815L2
  • US HTS 8471300100

PCN Information

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

BIOS Update [ACADL357] for the Intel® NUC X15 Laptop Kits - LAPAC71G, LAPAC71H

Driver Pack for the Intel® NUC X15 Laptop Kit - LAPAC71H & LAPAC71G

Intel® Aptio* V UEFI Firmware Integrator Tools for Intel® NUC Laptops

Intel® NUC Software Studio for Gaming Laptops

Image Retention Removal Tool for the Intel NUC Laptop Products

Download

Support

Launch Date

The date the product was first introduced.

Warranty Period

Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

M.2 Card Slot (storage)

M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards

# of Thunderbolt™ Ports

Thunderbolt™ is a very high-speed, daisy-chainable interface that allows connection of multiple peripherals and displays to a computer. Thunderbolt™ 3 (40Gbps) uses a USB Type-C™ connector which combines PCI Express (PCIe Gen3), DisplayPort (DP 1.2), USB 3.1 Gen2 and provides up to 100W of DC power, all in one cable.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Bluetooth Version

Devices connect wirelessly via Bluetooth technology using radio waves instead of wires or cables to connect to a phone or computer. Communication between Bluetooth devices happens over short-range, establishing a network dynamically and automatically as Bluetooth devices enter and leave radio proximity.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.