Intel® NUC X15 Laptop Kit - LAPAC71H
Specifications
Compare Intel® Products
Essentials
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Product Collection
Intel® NUC X15 Laptop Kit
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Code Name
Products formerly Alder County
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Processor Included
Intel® Core™ i7-12700H Processor (24M Cache, up to 4.70 GHz)
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Discrete Graphics
Intel® Arc™ A730M
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Supported Operating Systems
Windows 11*, Windows 10*
Supplemental Information
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Marketing Status
Launched
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Launch Date
Q3'22
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Warranty Period
2 yrs
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Embedded Options Available
No
CPU Specifications
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Total Cores
14
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Total Threads
20
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Max Turbo Frequency
4.70 GHz
Memory & Storage
I/O Specifications
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# of Thunderbolt™ Ports
1x Thunderbolt™ 4
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# of USB Ports
3
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Integrated LAN
Intel® i225-V
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Wireless Included
Intel® Wi-Fi 6 AX201 (Gig+)
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Bluetooth Version
5.2
Package Specifications
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TDP
45 W
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Chassis Dimensions
358.3mm x 235mm x 22.2mm
Ordering and Compliance
Ordering and spec information
Trade compliance information
- ECCN 5A992C
- CCATS G157815L2
- US HTS 8471300100
PCN Information
- 99C2JP PCN
Drivers and Software
Description
Type
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Latest Drivers & Software
Name
Intel® Aptio* V UEFI Firmware Integrator Tools
BIOS Update [ACADL357] for the Intel® NUC X15 Laptop Kits - LAPAC71G, LAPAC71H
Intel® NUC X15 Laptop Kit - LAPAC71G & LAPAC71H - Driver Pack
Intel® NUC Software Studio for Gaming Laptops
Image Retention Removal Tool for the Intel NUC Laptop Products
Support
Launch Date
The date the product was first introduced.
Warranty Period
Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Total Threads
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Max Turbo Frequency
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
M.2 Card Slot (storage)
M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards
# of Thunderbolt™ Ports
Thunderbolt™ is a very high-speed, daisy-chainable interface that allows connection of multiple peripherals and displays to a computer. Thunderbolt™ 3 (40Gbps) uses a USB Type-C™ connector which combines PCI Express (PCIe Gen3), DisplayPort (DP 1.2), USB 3.1 Gen2 and provides up to 100W of DC power, all in one cable.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Bluetooth Version
Devices connect wirelessly via Bluetooth technology using radio waves instead of wires or cables to connect to a phone or computer. Communication between Bluetooth devices happens over short-range, establishing a network dynamically and automatically as Bluetooth devices enter and leave radio proximity.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Give Feedback
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.