Intel® NUC M15 Laptop Kit - LAPRC510
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Intel® NUC M15 Laptop Kit
Products formerly Rooks County
Intel® Core™ i5-1240P Processor (12M Cache, up to 4.40 GHz)
Supported Operating Systems
355mm x 230mm x 15mm
Ordering and Compliance
Retired and discontinued
Bulk Intel® NUC M15 Laptop Kit, BRC510BAG7B02, w/Intel® Core™ i5, Black, FHD, 16GB, German Keyboard, w/ EU cord L7 (5 pack)
- MM# 99AMN7
- Ordering Code BRC510BAG7B02
Trade compliance information
- ECCN 5A992C
- CCATS G157815L2
- US HTS 8471300100
Drivers and Software
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Latest Drivers & Software
Intel® Aptio* V UEFI Firmware Integrator Tools
Provides Intel® Aptio* V UEFI Firmware Integrator Tools for Intel® NUC products.View download options.
BIOS Update for the Intel® NUC M15 Laptop Kit - LAPRCx10 [RCADL357]
This download record provides options for updating the Intel® Aptio* V UEFI Firmware of Intel® NUC M15 Laptop Kit - LAPRCx10View download options.
Intel® NUC Uniwill Service Driver for Intel® NUC Software Studio for Intel® NUC M15 Laptop Kits - LAPRC510 & LAPRC710
The Intel® NUC Uniwill Service Driver is required to ensure that all Intel® NUC Software Studio features are fully functional when installed on the Intel® NUC M15 Laptop Kits - LAPRC510 & LAPRC710View download options.
Driver Pack for the Intel® NUC M15 Laptop Kit - LAPRC710 & LAPRC510
Contains all the drivers needed for the Intel® NUC M15 Laptop Kits - LAPRC710, LAPRC510View download options.
The date the product was first introduced.
Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Max Turbo Frequency
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Pre-Installed Memory indicates presence of memory that comes factory loaded on the device.
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
M.2 Card Slot (storage)
M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards
# of Thunderbolt™ Ports
Thunderbolt™ is a very high-speed, daisy-chainable interface that allows connection of multiple peripherals and displays to a computer. Thunderbolt™ 3 (40Gbps) uses a USB Type-C™ connector which combines PCI Express (PCIe Gen3), DisplayPort (DP 1.2), USB 3.1 Gen2 and provides up to 100W of DC power, all in one cable.
Devices connect wirelessly via Bluetooth technology using radio waves instead of wires or cables to connect to a phone or computer. Communication between Bluetooth devices happens over short-range, establishing a network dynamically and automatically as Bluetooth devices enter and leave radio proximity.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
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Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.