Intel® NUC X15 Laptop Kit - LAPAC71G
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Intel® NUC X15 Laptop Kit
Products formerly Alder County
Supported Operating Systems
Windows 11*, Windows 10*
Intel® Core™ i7-12700H Processor (24M Cache, up to 4.70 GHz)
Max Turbo Frequency
Integrated Graphics ‡
Intel® Arc™ A550M
358.3mm x 235mm x 22.2mm
Ordering and Compliance
Ordering and spec information
Bulk Intel® NUC X15 Laptop Kit, BAC71GBBU6000, w/Intel® Core™ i7, DG2 SKU3, Black, FHD144, US ANSI Keyboard, w/ No cord L6, 5 pack
- MM# 99ANLT
- Ordering Code BAC71GBBU6000
Trade compliance information
- ECCN 5A992C
- CCATS G157815L2
- US HTS 8471300100
- 99ANLT PCN
Drivers and Software
No results found for
Latest Drivers & Software
Image Retention Removal Tool for the Intel NUC Laptop Products
This tool should remove any image retention/sticking on the Intel NUC Laptop DisplaysView download options.
BIOS Update [ACADL357] for the Intel® NUC X15 Laptop Kits - LAPAC71G, LAPAC71H
This download record provides options for updating the Intel® Aptio* V UEFI Firmware of the Intel® NUC X15 Laptop Kits - LAPAC71G, LAPAC71H.View download options.
Intel® NUC X15 Laptop Kit - LAPAC71G & LAPAC71H - Driver Pack
Windows 11* - Driver Pack for the Intel® NUC X15 Laptop Kits - LAPAC71G & LAPAC71HView download options.
Intel® Aptio* V UEFI Firmware Integrator Tools
Provides Intel® Aptio* V UEFI Firmware Integrator Tools for Intel® NUC products.View download options.
The date the product was first introduced.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Max Turbo Frequency
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
M.2 Card Slot (storage)
M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
# of Thunderbolt™ Ports
Thunderbolt™ is a very high-speed, daisy-chainable interface that allows connection of multiple peripherals and displays to a computer. Thunderbolt™ 3 (40Gbps) uses a USB Type-C™ connector which combines PCI Express (PCIe Gen3), DisplayPort (DP 1.2), USB 3.1 Gen2 and provides up to 100W of DC power, all in one cable.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.