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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Server System M20NTP1UR304

Specifications

Export specifications

Essentials

  • Product Collection Intel® Server M20NTP Family
  • Code Name Products formerly North Pass
  • Launch Date Q1'22
  • Marketing Status Discontinued
  • Expected Discontinuance 2022
  • EOL Announce Friday, December 2, 2022
  • Last Order Tuesday, December 20, 2022
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • Additional Extended Warranty Details Dual Processor Board Extended Warranty
  • Supported Operating Systems VMware ESXi* 7.0, Windows Server 2022*, Windows Server 2019*, Red Hat Enterprise Linux 8.4*, Red Hat Enterprise Linux 8.3*
  • Chassis Form Factor 1U Rack
  • Chassis Dimensions 26" x 17.2" x 1.7"
  • Board Form Factor 13.1"x12"
  • Compatible Product Series 3rd Generation Intel® Xeon® Scalable Processors
  • Socket Dual Socket-P4 LGA4189
  • TDP 185 W
  • System Board Intel® Server Board M20NTP2SB
  • Board Chipset Intel® C621A Chipset
  • Target Market Entry
  • Rack-Friendly Board Yes
  • Power Supply 750 W
  • Power Supply Type AC
  • Included Items (1) 1U Chassis
    (1) Intel® Server Board M20NTP2SB
    (1) 750W Power supply AXXBFP750SLPS
    (1) Power distribution board
    (1) PCIe riser card (Riser Slot 1) M20NTP1URISER1
    (1) PCIe riser card (Riser Slot 2) M20NTP1URISER2
    (6) System fans MYP1UFAN
    (1) Air duct
    (4) Drive carrier assemblies Drive Tray + Drive Blank FXX35HSCAR3
    (1) 4x3.5” SATA/SAS/NVMe backplane AXXHSBP1304
    (1) Multi-port MiniSAS HD to 7-pin (x4 leads) SATA cable
    (1) 570mm I2C backplane communication cable
    (1) Front USB cable
    (1) Front control panel cable
    (2) Processor socket covers
    (2) 1U Processor heat sinks CYP1UHSSTD
    (2) Processor carrier clips ICXPHMMOQ2
    (14) Memory slot DIMM blanks TNPDMMBLNK
    (1) M.2 SSD retention clip
    (4) Mounting screws for OCP add-in option
  • New Design Availability Expiration Date Thursday, December 18, 2025

Supplemental Information

  • Description Intel developed and validated 1U server system integrated with an Intel® Server Board M20NTP2SB.

Memory & Storage

  • Storage Profile Hybrid Storage Profile
  • Memory Types DDR4 (RDIMM)
    Load Reduced DDR4 (LRDIMM)
  • # of Memory Slots 16
  • # of Front Drives Supported 4
  • Front Drive Form Factor Hot-swap 3.5" HDD or 2.5" SSD
  • # of Internal Drives Supported 1
  • Internal Drive Form Factor M.2 SSD

GPU Specifications

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 2

Intel® Transparent Supply Chain

  • Includes Statement of Conformance and Platform Certificate Yes

Ordering and Compliance

Retired and discontinued

Intel® Server System M20NTP1UR304, Single

  • MM# 99AL6R
  • Ordering Code M20NTP1UR304
  • MDDS Content IDs 804067

Trade compliance information

  • ECCN 5A992C
  • CCATS G157815L2
  • US HTS 8473305100

PCN Information

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 621A Chipset

View Details

Onboard Video Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 621A Chipset

View Details

Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems

View Details

Intel® Server M20NTP Family BIOS and Firmware Update SFUP Package (SFUP_BIOS/ME/BMC/FRU)

View Details

Intel® Server M20NTP Family BIOS and Firmware Update Package for UEFI

View Details
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Support

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Storage Profile

Hybrid Storage profiles are a combination of either SATA Solid State Drives (SSDs) or NVMe SSDs and Hard Disk Drives (HDDs). All-Flash storage profiles are a combination of NMVe* SSDs and SATA SSDs.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Integrated Graphics ‡

Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

Intel® Advanced Management Technology

Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.

Intel® Server Customization Technology

Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.

Intel® Efficient Power Technology

Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.

Intel® Quiet Thermal Technology

Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Quiet System Technology

Intel® Quiet System Technology can help reduce system noise and heat through more intelligent fan speed control algorithms.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Intel® Total Memory Encryption

TME – Total Memory Encryption (TME) helps protect data against exposure via physical attack on memory, such as cold-boot attacks.

Intel® Software Guard Extensions (Intel® SGX)

Intel® Software Guard Extensions (Intel® SGX) provide applications the ability to create hardware enforced trusted execution protection for their applications’ sensitive routines and data. Intel® SGX provides developers a way to partition their code and data into CPU hardened trusted execution environments (TEE’s).

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.