Intel® Server Board M20NTP2SB
Specifications
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Essentials
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Product Collection
Intel® Server Board M20NTP
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Code Name
Products formerly North Pass
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Marketing Status
Discontinued
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Launch Date
Q1'22
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Expected Discontinuance
2022
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EOL Announce
Friday, December 2, 2022
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Last Order
Tuesday, December 20, 2022
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Limited 3-year Warranty
Yes
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Extended Warranty Available for Purchase (Select Countries)
Yes
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Additional Extended Warranty Details
Dual Processor Board Extended Warranty
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Compatible Product Series
3rd Generation Intel® Xeon® Scalable Processors
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Board Form Factor
13.1"x12"
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Chassis Form Factor
Rack
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Socket
Dual Socket-P4 4189
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Integrated BMC with IPMI
Yes, IPMI 2.0 & Redfish support
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Rack-Friendly Board
Yes
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TDP
250 W
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Board Chipset
Intel® C621A Chipset
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Target Market
Entry
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Supplemental Information
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Embedded Options Available
No
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Description
Monolithic printed circuit board assembly with features that are intended for high density rack mount server systems.
This server board is designed to support the 3rd Gen Intel® Xeon® Scalable processor family.
Memory Specifications
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Max Memory Size (dependent on memory type)
4 TB
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Memory Types
DDR4 (RDIMM)
3DS-RDIMM
Load Reduced DDR4 (LRDIMM)
3DS-LRDIMM
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Max # of Memory Channels
16
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Max Memory Bandwidth
3200 GB/s
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# of Memory Slots
16
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ECC Memory Supported ‡
Yes
GPU Specifications
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Integrated Graphics ‡
Yes
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Graphics Output
VGA
Expansion Options
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PCI Express Revision
4.0
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Max # of PCI Express Lanes
96
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PCIe Slimline Connectors
4
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Riser Slot 1: Total # of Lanes
32
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Riser Slot 2: Total # of Lanes
32
I/O Specifications
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Open Compute Port (OCP) Support
Yes- V 2.0
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# of USB Ports
5
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USB Configuration
(2) External USB 3.0 connectors (Back panel I/O)
(1) USB 3.0 internal onboard Type-A connector
(1) 2 USB optional front panel
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USB Revision
3.0
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Total # of SATA Ports
14
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Max # of UPI Links
3
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RAID Configuration
Intel VROC for SATA
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# of Serial Ports
2
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# of LAN Ports
2
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Integrated LAN
YES
Package Specifications
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Max CPU Configuration
2
Advanced Technologies
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Advanced System Management key
Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
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Intel® Node Manager
Yes
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Intel® Quiet System Technology
Yes
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Intel® Flex Memory Access
Yes
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Intel® Advanced Management Technology
Yes
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Intel® Server Customization Technology
Yes
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Intel® Efficient Power Technology
Yes
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Intel® Quiet Thermal Technology
Yes
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TPM Version
2.0
Security & Reliability
Ordering and Compliance
Compatible Products
3rd Gen Intel® Xeon® Scalable Processors
Drivers and Software
Description
Type
More
OS
Version
Date
All
View Details
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Latest Drivers & Software
Name
Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 621A Chipset
Onboard Video Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 621A Chipset
Server Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems
Intel® Server M20NTP Family BIOS and Firmware Update SFUP Package (SFUP_BIOS/ME/BMC/FRU)
Intel® Server M20NTP Family BIOS and Firmware Update Package for UEFI
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
Max # of UPI Links
Intel® Ultra Path Interconnect (UPI) links are a high speed, point-to-point interconnect bus between the processors, delivering increased bandwidth and performance over Intel® QPI.
RAID Configuration
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
# of LAN Ports
LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
Intel® Quiet System Technology
Intel® Quiet System Technology can help reduce system noise and heat through more intelligent fan speed control algorithms.
Intel® Flex Memory Access
Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.
Intel® Advanced Management Technology
Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.
Intel® Server Customization Technology
Intel® Server Customization technology enables Resellers and System Builders to offer end customers a customized branded experience, SKU configuration flexibility, flexible boot options, and maximum I/O options.
Intel® Efficient Power Technology
Intel® Efficient Power Technology is a series of improvements within Intel power supplies and voltage regulators to increase power delivery efficiency and reliability. The technology is included in all common redundant power supplies (CRPS). CRPS includes the following technologies; 80 PLUS Platinum (92% efficient at 50% load) efficiency, cold redundancy, closed loop system protection, smart ride through, dynamic redundancy detection, black box recorder, compatibility bus, and auto firmware updates to provide more efficient power delivery to the system.
Intel® Quiet Thermal Technology
Intel® Quiet Thermal Technology is a series of thermal and acoustic management innovations that reduce unnecessary acoustic noise and provide cooling flexibility while maximizing efficiency . The technology includes capabilities such as advanced thermal sensory arrays, advanced cooling algorithms, and built in fail-safe shutdown protection.
TPM Version
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.