Intel® Killer™ Ethernet E3100 2.5 Gbps
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Intel® Killer™ Ethernet Controller
Products formerly Foxville
Supported Operating Systems
Windows 10, Linux
Operating Temperature Range
0°C to 70°C
Operating Temperature (Maximum)
Operating Temperature (Minimum)
Data Rate Per Port
System Interface Type
PCIe 3.1 (5GT/s)
NC Sideband Interface
Jumbo Frames Supported
Speed & Slot Width
7mm x 7mm
Ordering and Compliance
Drivers and Software
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Latest Drivers & Software
Intel® Network Adapter Driver for Windows Server 2022*
This download record installs version 26.7 of the Intel® Network Adapter using Windows Server 2022*View download options.
Intel® Killer Performance Suite
This download record installs Wi-Fi, Ethernet drivers and Killer Software for the Intel® Killer™ products.View download options.
The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Flexible Port Partitioning
Flexible Port Partitioning (FPP) technology utilizes industry standard PCI SIG SR-IOV to efficiently divide your physical Ethernet device into multiple virtual devices, providing Quality of Service by ensuring each process is assigned to a Virtual Function and is provided a fair share of the bandwidth.
Virtual Machine Device Queues (VMDq)
Virtual Machine Device Queues (VMDq) is a technology designed to offload some of the switching done in the VMM (Virtual Machine Monitor) to networking hardware specifically designed for this function. VMDq drastically reduces overhead associated with I/O switching in the VMM which greatly improves throughput and overall system performance
PCI-SIG* SR-IOV Capable
Single-Root I/O Virtualization (SR-IOV) involves natively (directly) sharing a single I/O resource between multiple virtual machines. SR-IOV provides a mechanism by which a Single Root Function (for example a single Ethernet Port) can appear to be multiple separate physical devices.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.