Intel® Server System M50CYP1UR204
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Intel® Server System M50CYP Family
Products formerly Coyote Pass
Limited 3-year Warranty
Extended Warranty Available for Purchase (Select Countries)
Chassis Form Factor
781 x 438 x 43 mm
Board Form Factor
18.79” x 16.84”
Rack Rails Included
Compatible Product Series
3rd Generation Intel® Xeon® Scalable Processors
Heat Sink Included
Intel® Server Board M50CYP2SB1U
Intel® C621A Chipset
Power Supply Type
# of Power Supply Included
Redundant Power Supported
(1) 1U 2.5"chassis with Quick Reference Label affixed to top cover – iPN K52548- xxx
(1) Intel® Server Board M50CYP2SB1U
(4) Hot-swap drive bays with drive mounting rails and blanks – iPN K53035-xxx
(1) Front panel (left) with two USB ports – iPN K67061- xxx
(1) Front control panel (right) with control/status buttons – iPN K48178- xxx
(1) 1U Hot-swap backplane spare CYPHSBP1204
(1) Cable wall Assembly (Left) –iPN K72602- xxx
(1) Cable wall Assembly (Right) – iPN K72603- xxx
(1) 1U Spare PCIe Riser CYP1URISER1STD
(16) DIMM Blank – iPN K91058- xxx
(1) Splitter power cable from server board to HSBP, 445/720 mm – iPN K61358- xxx
(1) I2C cable from server board to HSBP, 350 mm – iPN K63232- xxx
(2) EVAC heat sink– iPN K67428- xxx
(8) 1U Spare Fan Kit CYPFAN1UKIT
(2) Processor carrier clip – iPN J98484- xxx
NOTE: NO PSU included
Riser Card Included
1U Spare PCIe Riser CYP1URISER1STD
Integrated 1U system featuring an Intel® Server Board M50CYP2SB1U, supporting two 3rd Generation Intel® Xeon® Scalable processors, (4) 2.5" SSD with air cooling.
NOTE: NO PSU included
Memory & Storage
Riser Slot 1: Total # of Lanes
Riser Slot 2: Total # of Lanes
Riser Slot 3: Total # of Lanes
Max CPU Configuration
Ordering and Compliance
Ordering and spec information
Intel® Server System M50CYP1UR204, Single
- MM# 99A3TX
- Ordering Code M50CYP1UR204
Trade compliance information
- ECCN 5A002U
- CCATS G157815L1
- US HTS 8473301180
3rd Generation Intel® Xeon® Scalable Processors
Intel® Integrated RAID (Modules/System Boards)
Intel® RAID Backup (Batteries/Flash)
Intel® RAID Premium Features
Intel® Virtual RAID on CPU (Intel® VROC)
Management Module Options
Riser Card Options
Spare Cable Options
Spare Fan Options
Spare Power Options
100GbE Intel® Ethernet Network Adapter E810
25GbE Intel® Ethernet Network Adapter E810
Intel® Ethernet Network Adapter X710
Intel® Optane™ DC SSD Series
Intel® SSD D7 Series
Intel® SSD D5 Series
Intel® SSD D3 Series
Intel® SSD DC P4610 Series
Intel® SSD DC P4511 Series
Intel® SSD DC P4510 Series
Drivers and Software
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The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Intel® Optane™ Persistent Memory Supported
Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance. Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
# of UPI Links
Intel® Ultra Path Interconnect (UPI) links are a high speed, point-to-point interconnect bus between the processors, delivering increased bandwidth and performance over Intel® QPI.
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
Integrated SAS Ports
Integrated SAS indicates Serial Attached SCSI (Small Computer System Interface) support integrated into the board. SAS is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
Intel® Advanced Management Technology
Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.