Intel® Compute Module Liquid-Cooled HNS2600BPBRCT

Specifications

  • Product Collection Intel® Server System S2600BPR Family
  • Code Name Products formerly Buchanan Pass
  • Status Launched
  • Launch Date Q3'21
  • Expected Discontinuance 2024
  • Limited 3-year Warranty Yes
  • Extended Warranty Available for Purchase (Select Countries) Yes
  • Additional Extended Warranty Details Intel® Compute Module HNS2000 Extended Warranty
  • # of QPI Links 2
  • Compatible Product Series 2nd Generation Intel® Xeon® Scalable Processors
  • Supported Operating Systems Windows Server 2019*, Windows Server 2016*, Red Hat Enterprise Linux 7.6*, Red Hat Enterprise Linux 7.5*, SUSE Linux Enterprise Server 15*, SUSE Linux Enterprise Server 12 SP4*, Ubuntu*
  • Board Form Factor Custom 6.8" x 19.1"
  • Chassis Form Factor 2U Rack
  • Socket P
  • Integrated Systems Available Yes
  • Integrated BMC with IPMI IPMI 2.0 & Redfish
  • Rack-Friendly Board Yes
  • TDP 165 W
  • Included Items (1) 1U node tray
    (1) Intel® Server Board S2600BPBR
    (1) Power Docking Board FHWBPNPB
    (3) 40x56mm dual rotor managed fans FXX4056DRFAN2
    (1) 1U passive Rear heat sink – CPU #1 – CuAL – FXXHP78X108HS
    (1) 1U passive heat sink – CPU #2 – AL – FXXEA78X108HS
    (1) Air duct
    (1) External VGA port bracket
    (1) Slot 1 riser card
    (1) Slot 2 riser card w/80mm M.2 SSD slot.
    (1) Liquid-Cooling Loop Kit AXXBPCTKIT
    Required Items – Sold Separately:
    (1) Bridge Board Options: AHWBPBGB, AHWBP12GBGB, AHWBP12GBGBR5 or AHWBP12GBGBIT
    (1) or (2) 2nd Generation Intel® Xeon® Scalable Processors
    Up to(16) DDR4 RDIMM/LRDIMM

  • Board Chipset Intel® C621 Chipset
  • Target Market High Performance Computing

Supplemental Information

  • Embedded Options Available No
  • Description A hot-pluggable high-density compute module integrated with the Intel® Server Board S2600BPBR for large memory capability and flexible configuration options for the Intel® Server Chassis H2312XXLR3 or H2204XXLRE.

Memory Specifications

Processor Graphics

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 2

Intel® Transparent Supply Chain

  • Includes Statement of Conformance and Platform Certificate Yes
  • TPM Version 2.0

Ordering and Compliance

Ordering and spec information

Intel® Compute Module Liquid-Cooled HNS2600BPBRCT, Single

  • MM# 99AF58
  • Ordering Code HNS2600BPBRCT

Trade compliance information

  • ECCN 5A992C
  • CCATS G157815L2
  • US HTS 8473305100

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

System Event Log (SEL) Viewer Utility for Intel® Server Boards and Intel® Server Systems Based on Intel® 62X Chipset

Technical Documentation

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

# of QPI Links

QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max # of DIMMs

DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.

ECC Memory Supported

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Intel® Optane™ Persistent Memory Supported

Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance.  Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

# of LAN Ports

LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Intel® Optane™ Memory Supported

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

Intel® Virtualization Technology for Directed I/O (VT-d)

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® Remote Management Module Support

The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).

Intel® Node Manager

Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Intel® Trusted Execution Technology

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.