Intel® NUC 11 Pro Kit NUC11TNHi70L
Specifications
Compare Intel® Products
Essentials
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Product Collection
Intel® NUC Kit with 11th Generation Intel® Core™ Processors
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Code Name
Products formerly Tiger Canyon
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Marketing Status
Launched
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Launch Date
Q1'21
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Expected Discontinuance
1H'24
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Supported Operating Systems
Windows 11 Home*, Windows 11 Pro*, Windows 10 Home, 64-bit*, Windows 10 IoT Enterprise*, Windows 10 Pro, 64-bit*, Red Hat Linux*, Ubuntu 20.04 LTS*
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Board Number
NUC11TNBi7
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Board Form Factor
UCFF (4" x 4")
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Socket
Soldered-down BGA
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Internal Drive Form Factor
M.2 and 2.5" Drive
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# of Internal Drives Supported
2
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TDP
28 W
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DC Input Voltage Supported
12-20 VDC
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Processor Included
Intel® Core™ i7-1165G7 Processor (12M Cache, up to 4.70 GHz)
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Total Cores
4
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Total Threads
8
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Lithography
10 nm SuperFin
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Max Turbo Frequency
4.70 GHz
Supplemental Information
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Embedded Options Available
No
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Included Items
VESA bracket
Memory & Storage
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Max Memory Size (dependent on memory type)
64 GB
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Memory Types
DDR4-3200 1.2V SO-DIMMs
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Max # of Memory Channels
2
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Max # of DIMMs
2
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ECC Memory Supported ‡
No
Processor Graphics
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Integrated Graphics ‡
Yes
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Graphics Output
Dual HDMI 2.0b w/HDMI CEC, Dual DP 1.4a via Type C
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# of Displays Supported ‡
4
Expansion Options
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PCI Express Revision
Gen 4 (m.2 22x80 slot); Gen 3 (otherwise)
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PCI Express Configurations ‡
PCIe x4 Gen 4: M.2 22x80 (key M)
PCIe x1: M.2 22x30 (key E)
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M.2 Card Slot (wireless)
22x30 (E)
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M.2 Card Slot (storage)
22x80 NVMe (M)
I/O Specifications
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# of USB Ports
4
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USB Configuration
Front: 2x USB 3.2
Rear: 2x USB 4 (type C), 1x USB 3.2, 3x USB 2.0
Internal: 2x USB 2.0 (headers)
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Total # of SATA Ports
1
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Serial Port via Internal Header
Yes
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Integrated LAN
Dual Intel® Ethernet Controller i225-LM
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Integrated Wireless‡
Intel® Wi-Fi 6 AX201
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Integrated Bluetooth
Yes
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Additional Headers
Front_panel (PWR, RST, 5V, 5Vsby, 3.3Vsby); Internal 2x2 power connector
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# of Thunderbolt™ Ports
1x Thunderbolt™ 4, 1x Thunderbolt™ 3
Package Specifications
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Chassis Dimensions
117 x 112 x 54 [mm] (LxWxH)
Security & Reliability
Ordering and Compliance
Drivers and Software
Description
Type
More
OS
Version
Date
All
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Latest Drivers & Software
Name
Intel® Aptio* V UEFI Firmware Integrator Tools
BIOS Update [TNTGL357]
Intel® Serial IO Driver for Windows® 10 64-bit & Windows 11* for the Intel® NUC 11 Pro Kits & Mini PCs - NUC11TN
USB Type C Power Delivery Controller for Windows® 10 64-bit & Windows 11* for the Intel® NUC 11 Pro Kits & Mini PCs - NUC11TN
Intel® Thunderbolt™ Driver for Windows® 10 64-bit for Intel® NUC 11 Pro Kits & Mini PCs - NUC11TN
Intel® Rapid Storage Technology (Intel® RST) Driver for Windows® 10 64-bit & Windows 11* for Intel® NUC 11 Pro Kits & Mini PCs - NUC11TN
Intel® Management Engine (ME) Consumer Driver for Windows® 10 64-bit & Windows 11* for the Intel® NUC 11 Pro Kits & Mini PCs - NUC11TN
Intel® NUC Pro Software Suite (NPSS) Version 2
Intel® Graphics DCH Driver for Windows® 10 & Windows 11* for the Intel® NUC 11 Pro Kits & Mini PCs - NUC11TN
Intel® Ethernet (LAN) Driver for Windows® 10 or Windows 11* for Intel® NUC 11 Pro Kits & Mini PCs - NUC11TN
Intel® Chipset Device Software for Windows® 10 64-bit and Windows 11* for Intel® NUC Products
Intel® Wireless Technology-Based Driver for Windows® 10 & Windows* 11 for Intel® NUC Products
Intel® Wireless Bluetooth Driver for Windows® 10 64-Bit and Windows 11* for Intel® NUC
Patch for a Modern Standby LAN Issue on Intel® NUC 11th & 12th Generation Products
Intel® GNA Scoring Accelerator Driver for Windows® 10 64-bit & Windows 11* for Intel® NUC 11 Pro Kits & Mini PCs - NUC11TN
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Total Threads
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Max Turbo Frequency
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max # of DIMMs
DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCI Express Configurations ‡
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.
M.2 Card Slot (wireless)
M.2 Card Slot (wireless) indicates presence of an M.2 slot that's keyed for wireless expansion cards
M.2 Card Slot (storage)
M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Additional Headers
Additional Headers indicates presence of additional interfaces such as NFC, auxiliary power, and others.
# of Thunderbolt™ Ports
Thunderbolt™ is a very high-speed, daisy-chainable interface that allows connection of multiple peripherals and displays to a computer. Thunderbolt™ 3 (40Gbps) uses a USB Type-C™ connector which combines PCI Express (PCIe Gen3), DisplayPort (DP 1.2), USB 3.1 Gen2 and provides up to 100W of DC power, all in one cable.
Intel® Optane™ Memory Supported ‡
Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® ME Firmware Version
Intel® Management Engine Firmware (Intel® ME FW) uses built-in platform capabilities and management and security applications to remotely manage networked computing assets out-of-band.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® Platform Trust Technology (Intel® PTT)
Intel® Platform Trust Technology (Intel® PTT) is a platform functionality for credential storage and key management used by Windows 8* and Windows® 10. Intel® PTT supports BitLocker* for hard drive encryption and supports all Microsoft requirements for firmware Trusted Platform Module (fTPM) 2.0.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Give Feedback
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.