Intel® Server Board M70KLP2SB

Specifications

Supplemental Information

  • Embedded Options Available No
  • Description Four socket system board for use in the 2U Intel® Server System M70KLP featuring 3rd Generation Intel® Xeon® processors.
    Optimized for scale-up or scale-out consolidation use cases.

Memory Specifications

Expansion Options

I/O Specifications

Package Specifications

  • Max CPU Configuration 4

Intel® Transparent Supply Chain

Ordering and Compliance

Ordering and spec information

Intel® Server Board M70KLP2SB, Single

  • MM# 99AF08
  • Ordering Code M70KLP2SB

Trade compliance information

  • ECCN 5A002U
  • CCATS G157815L1
  • US HTS 8473301180

Compatible Products

3rd Generation Intel® Xeon® Scalable Processors

Product Name Status Launch Date # of Cores Max Turbo Frequency Processor Base Frequency Cache TDP Sort Order Compare
All | None
Intel® Xeon® Platinum 8380HL Processor Launched Q2'20 28 4.30 GHz 2.90 GHz 38.5 MB 250 W 1
Intel® Xeon® Platinum 8380H Processor Launched Q2'20 28 4.30 GHz 2.90 GHz 38.5 MB 250 W 4
Intel® Xeon® Platinum 8376HL Processor Launched Q2'20 28 4.30 GHz 2.60 GHz 38.5 MB 205 W 49
Intel® Xeon® Platinum 8376H Processor Launched Q2'20 28 4.30 GHz 2.60 GHz 38.5 MB 205 W 52
Intel® Xeon® Platinum 8360HL Processor Launched Q3'20 24 4.20 GHz 3.00 GHz 33 MB 225 W 141
Intel® Xeon® Platinum 8360H Processor Launched Q3'20 24 4.20 GHz 3.00 GHz 33 MB 225 W 146
Intel® Xeon® Platinum 8356H Processor Launched Q3'20 8 4.40 GHz 3.90 GHz 35.75 MB 190 W 161
Intel® Xeon® Platinum 8354H Processor Launched Q2'20 18 4.30 GHz 3.10 GHz 24.75 MB 205 W 169
Intel® Xeon® Platinum 8353H Processor Launched Q2'20 18 3.80 GHz 2.50 GHz 24.75 MB 150 W 173
Intel® Xeon® Gold 6348H Processor Launched Q2'20 24 4.20 GHz 2.30 GHz 33 MB 165 W 228
Intel® Xeon® Gold 6330H Processor Launched Q3'20 24 3.70 GHz 2.00 GHz 33 MB 150 W 254
Intel® Xeon® Gold 6328HL Processor Launched Q2'20 16 4.30 GHz 2.80 GHz 22 MB 165 W 261
Intel® Xeon® Gold 6328H Processor Launched Q2'20 16 4.30 GHz 2.80 GHz 22 MB 165 W 264

Intel® Server System M70KLP Family

Product Name Status Sort Order Compare
All | None
Intel® Server System M70KLP4S2UHH Launched 50141

Intel® Optane™ Persistent Memory 200 Series

Compare
All | None

Drivers and Software

Latest Drivers & Software

Downloads Available:
All

Name

Technical Documentation

Launch Date

The date the product was first introduced.

Expected Discontinuance

Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.

Integrated BMC with IPMI

IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max # of DIMMs

DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.

Intel® Optane™ Persistent Memory Supported

Intel® Optane™ persistent memory is a revolutionary tier of non-volatile memory that sits between memory and storage to provide large, affordable memory capacity that is comparable to DRAM performance.  Delivering large system-level memory capacity when combined with traditional DRAM, Intel Optane persistent memory is helping transform critical memory constrained workloads – from cloud, databases, in-memory analytics, virtualization, and content delivery networks.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe x8 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

PCIe x16 Gen 3

PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).

Connector for Intel® Integrated RAID Module

Internal IO expansion module indicates a mezzanine connector on Intel® Server Boards that supports a variety of Intel(r) I/O Expansion Modules using a x8 PCI Express* interface. These modules are either RoC (RAID-on-Chip) or SAS (Serial Attached SCSI) modules that are not used for external connectivity through the rear I/O panel.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

Total # of SATA Ports

SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

# of Serial Ports

A Serial Port is a computer interface used for connecting peripherals.

TPM Version

TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.