Intel® Server System D50TNP1MHCRAC Compute Module
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Intel® Server System D50TNP Family
Products formerly Tennessee Pass
Limited 3-year Warranty
Extended Warranty Available for Purchase (Select Countries)
Compatible Product Series
3rd Generation Intel® Xeon® Scalable Processors
Board Form Factor
8.33” x 21.5”
Chassis Form Factor
Integrated BMC with IPMI
IPMI 2.0 & Redfish
(1) Intel® Server Board DDR4 D50TNP1SBCR
(1) 1U half-width module tray – iPN K53210
(1) 1U compute module air duct – iPN K61940
(2) 1U PCIe Riser (x16 PCIe slot and M.2 Connector) for D50TNP1SBCR board TNP1UCRRISER
(2) 1U riser bracket to support TNP1UCRRISER – iPN K25206
(1) 1U Air-Cooled front Heat Sink TNP1UHSF
(1) 1U Air-Cooled Rear Heat Sink TNP1UHSB
(2) Processor carrier clip, for 3rd Gen Intel® Xeon® Scalable processor family iPN J98484
(2) M.2 heat sink assembly TNPM2HS
Intel® C621A Chipset
High Performance Computing
Embedded Options Available
A 1U high-density half-width compute module integrated with Intel® Server Board DDR4 D50TNP1SBCR for large memory capability and flexible configuration options for the Intel® Server Chassis FC2000 Family
Max CPU Configuration
Intel® Transparent Supply Chain
Ordering and Compliance
Ordering and spec information
Intel® Server System D50TNP1MHCRAC Compute Module , Single
- MM# 99A84D
- Ordering Code D50TNP1MHCRAC
Trade compliance information
- ECCN 5A002U
- CCATS G157815L1
- US HTS 8473301180
3rd Generation Intel® Xeon® Scalable Processors
Intel® Server Board D50TNP Family
Intel® Virtual RAID on CPU (Intel® VROC)
Management Module Options
Spare Cable Options
Spare Chassis Maintenance Options
Spare Heat-Sink Options
Spare Riser Card Options
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Intel® Ethernet Network Adapter XXV710
Intel® Ethernet Network Adapter X710
Intel® Ethernet Converged Network Adapter X550
Intel® Ethernet Server Adapter I350 Series
Intel® Optane™ DC SSD Series
Intel® SSD D3 Series
Intel® SSD DC P4511 Series
Intel® Omni-Path Host Fabric Interface PCIe Adapter 100 Series
Drivers and Software
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Latest Drivers & Software
Download Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 621A Chipset
The Intel® Chipset Device Software installs Windows* INF files to the target system based on Intel 621A Chipset.View download options.
Download Intel® Server Debug and Provisioning Tool (Intel® SDP Tool) for Windows*
The Intel® Server Debug and Provisioning Tool (Intel® SDP Tool) is used to debug and provision Intel® Server Boards and Systems through BMC out-of-band. (Version 1.4 Build 4)View download options.
Version 1.4 Build 4
Download Intel® Server System D50TNP Product Family Power Budget and Thermal Configuration Tool
The Intel® Server System D50TNP Power Budget and Thermal Configuration Tool calculates the power usage and thermal configuration. (1.1)View download options.
Download Intel® Server Board D50TNP Family BIOS and System Firmware Update Package (SFUP) for Windows* and Linux*
This download contains the System Firmware Update Package (SFUP) for the Intel® Server Board D50TNP Family for Windows and Linux (R01.01.003)0003)View download options.
Download Intel® Server Board D50TNP Family BIOS and Firmware Update Package for UEFI
This download record contains the BIOS and firmware update package for the Intel® Server Board D50TNP Family for UEFI (R01.01.0003).View download options.
Download Onboard Network Driver for Intel® Server Boards and Systems Based on Intel® 621A Chipset
Provides onboard network driver for Intel® Server Board M50CYP and D50TNP Family.View download options.
Download Onboard Video Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 621A Chipset
Windows* ASPEED* Onboard Video driver for Intel® Server Board M50CYP, D50TNP Family.View download options.
Download Intel® Virtual RAID on CPU (Intel® VROC) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 621A Chipset
Provides Intel® VROC Windows* driver for M50CYP/D50TNP families.View download options.
Download Intel® Configuration Detector for Linux*
A Linux script that collects the hardware and software configuration of an x86 system without additional software installation.View download options.
Download Intel® Server Debug and Provisioning Tool (Intel® SDP Tool)
The Intel® Server Debug and Provisioning Tool (Intel® SDP Tool) is used to debug and provision Intel® Server Boards and Systems through BMC out-of-band. (2.1.1))View download options.
Download Save and Restore System Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems Based on Intel® 621 A Chipset
Save and Restore System Configuration Utility (syscfg) for Intel® Server Boards and Intel® Server Systems Based on Intel® 621 A Chipset (V14.2 Build 8)View download options.
V14.2 Build 8
Download System Information Retrieval Utility (SysInfo) for Intel® Server Boards and Intel® Server Systems Based on Intel® 621 A Chipset
System Information Retrieval Utility (SysInfo) for Intel® Server Boards and Intel® Server Systems Based on Intel® 621 A Chipset (V 14.2 Build 7)View download options.
V 14.2 Build 7
Download System Firmware Update Utility(SysFwUpdt) for Intel® Server Boards and Intel® Server Systems Based on Intel® 621A Chipset
System Firmware Update Utility(SysFwUpdt) for Intel® Server Boards and Intel® Server Systems Based on Intel® 621A Chipset (V14.2 Build 9)View download options.
V14.2 Build 11
The date the product was first introduced.
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
Max # of DIMMs
DIMM (Dual In-line Memory Module) is a series of DRAM (Dynamic Random-Access Memory) IC's mounted on a small printed circuit board.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output defines the interfaces available to communicate with display devices.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
# of UPI Links
Intel® Ultra Path Interconnect (UPI) links are a high speed, point-to-point interconnect bus between the processors, delivering increased bandwidth and performance over Intel® QPI.
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
Intel® Advanced Management Technology
Intel® Advanced Management Technology features an isolated, independent, secure, and highly reliable network connection, with an Integrated Baseboard Management Controller (Integrated BMC) configuration from within BIOS. Also includes an embedded web user interface that launches key platform diagnostic capabilities over the network, an out-of-band (OOB) platform inventory, failsafe firmware updates, and an automatic Integrated BMC stall detection and reset.
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.