Cyclone® IV EP4CE30 FPGA
Specifications
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Essentials
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Product Collection
Cyclone® IV E FPGA
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Marketing Status
Launched
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Launch Date
2009
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Lithography
60 nm
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Resources
I/O Specifications
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Maximum User I/O Count†
532
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I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.2 V to 3.3 V LVCMOS, PCI, PCI-X, SSTL, HSTL, Differential SSTL, Differential HSTL, LVDS, Mini-LVDS, RSDS, LVPECL, BLVDS, PPDS
Advanced Technologies
Package Specifications
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Package Options
U484, F324, F484, F780
Supplemental Information
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Additional Information
Product Table (Family Comparison)
Cyclone IV Featured Documentation
All FPGA Documentation
Ordering and Compliance
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Ordering and spec information
Trade compliance information
- ECCN Varies By Product
- CCATS NA
- US HTS 8542390001
PCN Information
SR644
- 967305 PCN
SR648
- 967309 PCN
SR647
- 967308 PCN
SR646
- 967307 PCN
SR645
- 967306 PCN
SRCGH
- 974418 PCN
SRB56
- 973196 PCN
SRB55
- 973195 PCN
SRB54
- 973194 PCN
SRB53
- 973193 PCN
SRAMK
- 972522 PCN
SRB52
- 973192 PCN
SRAGS
- 971895 PCN
SRAGR
- 971894 PCN
SR9D6
- 971163 PCN
SRAGQ
- 971893 PCN
SR9D5
- 971162 PCN
SRAGP
- 971892 PCN
SR9D4
- 971161 PCN
SR9D3
- 971160 PCN
SRAGN
- 971891 PCN
SR9D2
- 971159 PCN
SRAMJ
- 972521 PCN
SRB51
- 973191 PCN
SRB50
- 973190 PCN
SRAMH
- 972520 PCN
SRAMG
- 972519 PCN
SR8HQ
- 970214 PCN
SR5WK
- 967036 PCN
SR5WJ
- 967035 PCN
Drivers and Software
Description
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Latest Drivers & Software
Launch Date
The date the product was first introduced.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Logic Elements (LE)
Logic elements (LEs) are the smallest units of logic in Intel® FPGA architecture. LEs are compact and provide advanced features with efficient logic usage.
Fabric and I/O Phase-Locked Loops (PLLs)
Fabric and IO PLLs are used to simplify the design and implementation of the clock networks in the Intel FPGA fabric, and also the clock networks associated with the IO cells in the device.
Maximum Embedded Memory
The total capacity of all the embedded memory blocks in the programmable fabric of the Intel FPGA device.
Digital Signal Processing (DSP) Blocks
The digital signal processing (DSP) block is the mathematical building block in supported Intel FPGA devices and contains high-performance multipliers and accumulators to implement a variety of digital signal processing functions.
Digital Signal Processing (DSP) Format
Depending on the Intel FPGA device family, the DSP block supports different formats such as hard floating point, hard fixed point, multiply and accumulate, and multiply only.
Hard Memory Controllers
Hard memory controllers are used to enable high-performance external memory systems attached to the Intel FPGA. A hard memory controller saves power and FPGA resources compared to the equivalent soft memory controller, and supports higher frequency operation.
External Memory Interfaces (EMIF)
The external memory interface protocols supported by the Intel FPGA device.
Maximum User I/O Count†
The maximum number of general purpose I/O pins in the Intel FPGA device, in the largest available package.
† Actual count could be lower depending on package.
I/O Standards Support
The general purpose I/O interface standards supported by the Intel FPGA device.
FPGA Bitstream Security
Depending on the Intel FPGA device family, various security features are available to prevent copying of the customer bitstream, and detect attempts to tamper with the device during operation.
Analog-to-Digital Converter
The analog-to-digital converter is a data-converter resource available in some Intel FPGA device families.
Package Options
Intel FPGA devices are available in different package sizes, with different IO and transceiver counts, to match customer system requirements.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.