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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Cyclone® 10 10CL006 FPGA

Specifications

Export specifications

Essentials

I/O Specifications

Package Specifications

Supplemental Information

Ordering and Compliance

Ordering and spec information

Intel® Cyclone® 10 10CL006 FPGA 10CL006YE144C8G

  • MM# 965562
  • Spec Code SR4N3
  • Ordering Code 10CL006YE144C8G
  • Stepping A1
  • MDDS Content IDs 744190,  698725

Intel® Cyclone® 10 10CL006 FPGA 10CL006YU256C6G

  • MM# 967109
  • Spec Code SR5YH
  • Ordering Code 10CL006YU256C6G
  • Stepping A1
  • MDDS Content IDs 745571,  692907

Intel® Cyclone® 10 10CL006 FPGA 10CL006ZU256I8G

  • MM# 967110
  • Spec Code SR5YJ
  • Ordering Code 10CL006ZU256I8G
  • Stepping A1
  • MDDS Content IDs 746646,  697759

Intel® Cyclone® 10 10CL006 FPGA 10CL006YU256I7G

  • MM# 968794
  • Spec Code SR7CU
  • Ordering Code 10CL006YU256I7G
  • Stepping A1
  • MDDS Content IDs 745436,  702298

Intel® Cyclone® 10 10CL006 FPGA 10CL006YU256C8G

  • MM# 973647
  • Spec Code SRBJJ
  • Ordering Code 10CL006YU256C8G
  • Stepping A1
  • MDDS Content IDs 744306,  699546

Intel® Cyclone® 10 10CL006 FPGA 10CL006YU256A7G

  • MM# 999A2M
  • Spec Code SRF51
  • Ordering Code 10CL006YU256A7G
  • Stepping A1
  • MDDS Content IDs 691713

Trade compliance information

  • ECCN EAR99
  • CCATS NA
  • US HTS 8542390001

PCN Information

SR5YJ

SR5YH

SRBJJ

SRF51

SR4N3

SR7CU

Drivers and Software

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Launch Date

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Logic Elements (LE)

Logic elements (LEs) are the smallest units of logic in Intel® FPGA architecture. LEs are compact and provide advanced features with efficient logic usage.

Fabric and I/O Phase-Locked Loops (PLLs)

Fabric and IO PLLs are used to simplify the design and implementation of the clock networks in the Intel FPGA fabric, and also the clock networks associated with the IO cells in the device.

Maximum Embedded Memory

The total capacity of all the embedded memory blocks in the programmable fabric of the Intel FPGA device.

Digital Signal Processing (DSP) Blocks

The digital signal processing (DSP) block is the mathematical building block in supported Intel FPGA devices and contains high-performance multipliers and accumulators to implement a variety of digital signal processing functions.

Digital Signal Processing (DSP) Format

Depending on the Intel FPGA device family, the DSP block supports different formats such as hard floating point, hard fixed point, multiply and accumulate, and multiply only.

Maximum User I/O Count†

The maximum number of general purpose I/O pins in the Intel FPGA device, in the largest available package.
† Actual count could be lower depending on package.

I/O Standards Support

The general purpose I/O interface standards supported by the Intel FPGA device.

Maximum LVDS Pairs

The maximum number of LVDS pairs that can be configured in the Intel FPGA device, in the largest available package. Refer to device documentation for actual RX and TX LVDS pairs count by package type.

Package Options

Intel FPGA devices are available in different package sizes, with different IO and transceiver counts, to match customer system requirements.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.