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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® Cyclone® 10 10CX085 FPGA

Specifications

Export specifications

Essentials

I/O Specifications

Advanced Technologies

Package Specifications

Supplemental Information

Ordering and Compliance

Ordering and spec information

Intel® Cyclone® 10 10CX085 FPGA 10CX085YF672I5G

  • MM# 978968
  • Spec Code SRCYL
  • Ordering Code 10CX085YF672I5G
  • Stepping A1
  • ECCN 3A991D
  • MDDS Content IDs 744806,  694280

Intel® Cyclone® 10 10CX085 FPGA 10CX085YU484I6G

  • MM# 978969
  • Spec Code SRCYM
  • Ordering Code 10CX085YU484I6G
  • Stepping A1
  • ECCN EAR99
  • MDDS Content IDs 744772,  694522

Intel® Cyclone® 10 10CX085 FPGA 10CX085YU484I5G

  • MM# 978973
  • Spec Code SRCYR
  • Ordering Code 10CX085YU484I5G
  • Stepping A1
  • ECCN EAR99
  • MDDS Content IDs 744326,  702378

Intel® Cyclone® 10 10CX085 FPGA 10CX085YU484E5G

  • MM# 978977
  • Spec Code SRCYV
  • Ordering Code 10CX085YU484E5G
  • Stepping A1
  • ECCN EAR99
  • MDDS Content IDs 744515,  694950

Intel® Cyclone® 10 10CX085 FPGA 10CX085YF672E6G

  • MM# 978984
  • Spec Code SRCZ2
  • Ordering Code 10CX085YF672E6G
  • Stepping A1
  • ECCN 3A991D
  • MDDS Content IDs 699923

Intel® Cyclone® 10 10CX085 FPGA 10CX085YU484E6G

  • MM# 978986
  • Spec Code SRCZ4
  • Ordering Code 10CX085YU484E6G
  • Stepping A1
  • ECCN EAR99
  • MDDS Content IDs 745929,  692598

Intel® Cyclone® 10 10CX085 FPGA 10CX085YF672E5G

  • MM# 978991
  • Spec Code SRCZ8
  • Ordering Code 10CX085YF672E5G
  • Stepping A1
  • ECCN 3A991D
  • MDDS Content IDs 698750

Intel® Cyclone® 10 10CX085 FPGA 10CX085YF672I6G

  • MM# 978992
  • Spec Code SRCZ9
  • Ordering Code 10CX085YF672I6G
  • Stepping A1
  • ECCN 3A991D
  • MDDS Content IDs 697344

Trade compliance information

  • ECCN Varies By Product
  • CCATS NA
  • US HTS 8542390001

PCN Information

SRCYL

SRCZ9

SRCZ8

SRCYV

SRCZ4

SRCYR

SRCZ2

SRCYM

Drivers and Software

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Launch Date

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Logic Elements (LE)

Logic elements (LEs) are the smallest units of logic in Intel® FPGA architecture. LEs are compact and provide advanced features with efficient logic usage.

Adaptive Logic Modules (ALM)

The adaptive logic module (ALM) is the logic building block in supported Intel FPGA devices, and is designed to maximize both performance and utilization. Each ALM has several different modes of operation, and can implement a variety of different combinatorial and sequential logical functions.

Adaptive Logic Module (ALM) Registers

ALM registers are those register bits (flip-flops) that are contained inside the ALMs and are used to implement sequential logic.

Fabric and I/O Phase-Locked Loops (PLLs)

Fabric and IO PLLs are used to simplify the design and implementation of the clock networks in the Intel FPGA fabric, and also the clock networks associated with the IO cells in the device.

Maximum Embedded Memory

The total capacity of all the embedded memory blocks in the programmable fabric of the Intel FPGA device.

Digital Signal Processing (DSP) Blocks

The digital signal processing (DSP) block is the mathematical building block in supported Intel FPGA devices and contains high-performance multipliers and accumulators to implement a variety of digital signal processing functions.

Digital Signal Processing (DSP) Format

Depending on the Intel FPGA device family, the DSP block supports different formats such as hard floating point, hard fixed point, multiply and accumulate, and multiply only.

Hard Memory Controllers

Hard memory controllers are used to enable high-performance external memory systems attached to the Intel FPGA. A hard memory controller saves power and FPGA resources compared to the equivalent soft memory controller, and supports higher frequency operation.

External Memory Interfaces (EMIF)

The external memory interface protocols supported by the Intel FPGA device.

Maximum User I/O Count†

The maximum number of general purpose I/O pins in the Intel FPGA device, in the largest available package.
† Actual count could be lower depending on package.

I/O Standards Support

The general purpose I/O interface standards supported by the Intel FPGA device.

Maximum LVDS Pairs

The maximum number of LVDS pairs that can be configured in the Intel FPGA device, in the largest available package. Refer to device documentation for actual RX and TX LVDS pairs count by package type.

Maximum Non-Return to Zero (NRZ) Transceivers†

The maximum number of NRZ transceivers in the Intel FPGA device, in the largest available package.
† Actual count could be lower depending on package.

Maximum Non-Return to Zero (NRZ) Data Rate†

The maximum NRZ data rate that is supported by the NRZ transceivers.
† Actual data rate could be lower depending on transceiver speed grade.

Transceiver Protocol Hard IP

Hard intellectual property available in the Intel FPGA device to support the high-speed serial transceivers. Transceiver protocol hard IP saves power and FPGA resources compared to the equivalent soft IP, and simplifies the implementation of the serial protocol.

FPGA Bitstream Security

Depending on the Intel FPGA device family, various security features are available to prevent copying of the customer bitstream, and detect attempts to tamper with the device during operation.

Package Options

Intel FPGA devices are available in different package sizes, with different IO and transceiver counts, to match customer system requirements.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.