Intel® MAX® 10 10M08 FPGA
Specifications
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Essentials
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Product Collection
Intel® MAX® 10 FPGA
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Marketing Status
Launched
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Launch Date
2014
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Lithography
55 nm
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I/O Specifications
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Maximum User I/O Count†
250
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I/O Standards Support
3.0 V to 3.3 V LVTTL, 1.0 V to 3.3 V LVCMOS, PCI, SSTL, HSTL, HSUL, Differential SSTL, Differential HSTL, Differential HSUL, LVDS, Mini-LVDS, RSDS, LVPECL, PPDS, BLVDS, TMDS, Sub-LVDS, SLVS, HiSpi
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Maximum LVDS Pairs
15
Advanced Technologies
Package Specifications
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Package Options
V81, F256, U324, F484, E144, M153, U169, U324
Supplemental Information
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Additional Information
Product Table (Family Comparison)
Datasheet
All FPGA Documentation
Ordering and Compliance
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Ordering and spec information
Trade compliance information
- ECCN Varies By Product
- CCATS NA
- US HTS 8542390001
PCN Information
SR4DF
- 965259 PCN
SR4NP
- 965582 PCN
SR4DE
- 965257 PCN
SR4DD
- 965256 PCN
SR6HB
- 967762 PCN
SR6HA
- 967761 PCN
SR7DJ
- 968819 PCN
SR7DH
- 968818 PCN
SR7DG
- 968817 PCN
SR4NS
- 965586 PCN
SR7DF
- 968816 PCN
SR4NR
- 965584 PCN
SR4NQ
- 965583 PCN
SR6H5
- 967756 PCN
SR4KY
- 965487 PCN
SR6H4
- 967755 PCN
SR4KX
- 965486 PCN
SR6H3
- 967754 PCN
SR4KW
- 965485 PCN
SR6H2
- 967753 PCN
SR6H1
- 967752 PCN
SR6SS
- 968101 PCN
SR6SQ
- 968098 PCN
SR6SP
- 968097 PCN
SR5Z5
- 967131 PCN
SR5Z4
- 967130 PCN
SR6H0
- 967751 PCN
SRCZ3
- 978985 PCN
SRCZ1
- 978983 PCN
SRCZ0
- 978982 PCN
SR6ST
- 968102 PCN
SRKJH
- 99A9T9 PCN
SRKJJ
- 99A9TA PCN
SRBK5
- 973669 PCN
Drivers and Software
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Latest Drivers & Software
Launch Date
The date the product was first introduced.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Logic Elements (LE)
Logic elements (LEs) are the smallest units of logic in Intel® FPGA architecture. LEs are compact and provide advanced features with efficient logic usage.
Fabric and I/O Phase-Locked Loops (PLLs)
Fabric and IO PLLs are used to simplify the design and implementation of the clock networks in the Intel FPGA fabric, and also the clock networks associated with the IO cells in the device.
Maximum Embedded Memory
The total capacity of all the embedded memory blocks in the programmable fabric of the Intel FPGA device.
Digital Signal Processing (DSP) Format
Depending on the Intel FPGA device family, the DSP block supports different formats such as hard floating point, hard fixed point, multiply and accumulate, and multiply only.
Hard Memory Controllers
Hard memory controllers are used to enable high-performance external memory systems attached to the Intel FPGA. A hard memory controller saves power and FPGA resources compared to the equivalent soft memory controller, and supports higher frequency operation.
External Memory Interfaces (EMIF)
The external memory interface protocols supported by the Intel FPGA device.
User-Flashable Memory
User-flashable memory is a non-volatile memory resource available in some Intel FPGA device families.
Internal Configuration Storage
Intel FPGAs store configuration data either in internal configuration storage, or in external memory devices.
Maximum User I/O Count†
The maximum number of general purpose I/O pins in the Intel FPGA device, in the largest available package.
† Actual count could be lower depending on package.
I/O Standards Support
The general purpose I/O interface standards supported by the Intel FPGA device.
Maximum LVDS Pairs
The maximum number of LVDS pairs that can be configured in the Intel FPGA device, in the largest available package. Refer to device documentation for actual RX and TX LVDS pairs count by package type.
FPGA Bitstream Security
Depending on the Intel FPGA device family, various security features are available to prevent copying of the customer bitstream, and detect attempts to tamper with the device during operation.
Analog-to-Digital Converter
The analog-to-digital converter is a data-converter resource available in some Intel FPGA device families.
Package Options
Intel FPGA devices are available in different package sizes, with different IO and transceiver counts, to match customer system requirements.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.