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  • Brand Name: Core i7

  • Product Number: i7-12700KF

  • Ordering Code: CM8071504553829

  • SPEC Code: SRL4P

  • Code Name: Alder Lake

Intel® NUC Board Element CMB2GB

Specifications

Export specifications

Essentials

Supplemental Information

  • Description The modular Intel® NUC Board Element is designed to take a range of Intel® NUC Compute Elements. Also available as modular carrier board with a built-in thermal solution. Ideal for providers creating embedded solutions.
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  • Additional Information View now

Processor Graphics

  • Graphics Output Dual HDMI 2.0b w/HDMI CEC, DP 1.4a via Type C, eDP
  • # of Displays Supported ‡ 4

Expansion Options

I/O Specifications

  • # of USB Ports 4
  • USB Configuration 1x rear USB 4 via Type C
    4x rear USB 3.2 Gen2 (10Gbps)
    2x USB 2.0 via internal headers
  • Integrated LAN Intel® i219-LM GbE
  • Additional Headers Front panel (PWR_SW, PWR_LED, RST, HDD_Act, 5V); Internal 2x2 power connector
  • # of Thunderbolt™ Ports 1x Thunderbolt™ 4

Ordering and Compliance

Ordering and spec information

Intel® NUC Board Element CMB2GB, 5 pack

Trade compliance information

  • ECCN EAR99
  • CCATS NA
  • US HTS 8473301180

PCN Information

Drivers and Software

Latest Drivers & Software

Downloads Available:
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Name

Intel® Gigabit Ethernet Network Connection Driver for Windows® 10 for Intel® NUC Chassis and Board Elements

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Support

Launch Date

The date the product was first introduced.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Warranty Period

Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

M.2 Card Slot (storage)

M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Additional Headers

Additional Headers indicates presence of additional interfaces such as NFC, auxiliary power, and others.

# of Thunderbolt™ Ports

Thunderbolt™ is a very high-speed, daisy-chainable interface that allows connection of multiple peripherals and displays to a computer. Thunderbolt™ 3 (40Gbps) uses a USB Type-C™ connector which combines PCI Express (PCIe Gen3), DisplayPort (DP 1.2), USB 3.1 Gen2 and provides up to 100W of DC power, all in one cable.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.