Intel® Core™ i3-1115G4E Processor
Specifications
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Essentials
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Product Collection
11th Generation Intel® Core™ i3 Processors
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Code Name
Products formerly Tiger Lake
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Vertical Segment
Embedded
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Processor Number
i3-1115G4E
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Lithography
10 nm SuperFin
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CPU Specifications
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Total Cores
2
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Total Threads
4
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Max Turbo Frequency
3.90 GHz
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Processor Base Frequency
2.20 GHz
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Cache
6 MB Intel® Smart Cache
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Bus Speed
4 GT/s
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TDP
15 W
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Configurable TDP-up Base Frequency
3.00 GHz
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Configurable TDP-up
28 W
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Configurable TDP-down Base Frequency
1.70 GHz
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Configurable TDP-down
12 W
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Intel® Deep Learning Boost (Intel® DL Boost) on CPU
Yes
Supplemental Information
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Marketing Status
Launched
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Launch Date
Q3'20
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Embedded Options Available
Yes
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Use Conditions
Embedded Broad Market Commercial Temp
Memory Specifications
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Max Memory Size (dependent on memory type)
64 GB
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Memory Types
DDR4-3200, LPDDR4x-3733
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Max # of Memory Channels
2
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ECC Memory Supported ‡
No
GPU Specifications
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GPU Name‡
Intel® UHD Graphics for 11th Gen Intel® Processors
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Graphics Max Dynamic Frequency
1.25 GHz
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Graphics Output
eDP 1.4b, MIPI-DSI 2.0, DP 1.4, HDMI 2.0b
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Execution Units
48
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Max Resolution (HDMI)‡
4096x2304@60Hz
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Max Resolution (DP)‡
7680x4320@60Hz
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Max Resolution (eDP - Integrated Flat Panel)‡
4096x2304@60Hz
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DirectX* Support
12.1
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OpenGL* Support
4.6
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OpenCL* Support
2.0
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Intel® Quick Sync Video
Yes
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Intel® Clear Video HD Technology
Yes
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# of Displays Supported ‡
4
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Device ID
0x9A78
Expansion Options
Package Specifications
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Sockets Supported
FCBGA1449
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Max CPU Configuration
1
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TJUNCTION
100C
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Max Operating Temperature
100 °C
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Minimum Operating Temperature
0 °C
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Package Size
45.5mm x 25mm
Advanced Technologies
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Intel® Gaussian & Neural Accelerator
2.0
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Intel® Image Processing Unit
6.0
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Intel® Smart Sound Technology
Yes
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Intel® High Definition Audio
Yes
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MIPI SoundWire*
1.1
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Intel® Speed Shift Technology
Yes
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Intel® Turbo Boost Technology ‡
2.0
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Intel® Hyper-Threading Technology ‡
Yes
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Instruction Set
64-bit
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Instruction Set Extensions
Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2, Intel® AVX-512
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Idle States
Yes
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Thermal Monitoring Technologies
Yes
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Intel® Volume Management Device (VMD)
Yes
Security & Reliability
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Intel® Control-Flow Enforcement Technology
Yes
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Intel® Total Memory Encryption
No
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Intel® AES New Instructions
Yes
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Intel® Software Guard Extensions (Intel® SGX)
No
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Intel® Trusted Execution Technology ‡
No
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Intel® OS Guard
Yes
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Intel® Boot Guard
Yes
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Mode-based Execute Control (MBEC)
Yes
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Intel® Virtualization Technology (VT-x) ‡
Yes
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Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Yes
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Intel® VT-x with Extended Page Tables (EPT) ‡
Yes
Ordering and Compliance
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Ordering and spec information
Trade compliance information
- ECCN 5A992CN3
- CCATS G167599
- US HTS 8542310001
Drivers and Software
Description
Type
More
OS
Version
Date
All
View Details
Download
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Latest Drivers & Software
Name
Intel® Arc™ & Iris® Xe Graphics - Windows*
Intel® Computing Improvement Program
Intel® Arc™ Graphics Driver - Ubuntu*
Support
Processor Number
The Intel processor number is just one of several factors—along with processor brand, system configurations, and system-level benchmarks—to be considered when choosing the right processor for your computing needs. Read more about interpreting Intel® processor numbers or Intel® processor numbers for the Data Center.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
Total Threads
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
Max Turbo Frequency
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
For more details regarding the dynamic power and frequency operating range, refer to
Cache
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
Bus Speed
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Configurable TDP-up Base Frequency
Configurable TDP-up Base Frequency is a processor operating mode where the processor behavior and performance is modified by raising TDP and the processor frequency to fixed points. The Configurable TDP-up Base Frequency is where the Configurable TDP-up is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.
Configurable TDP-up
Configurable TDP-up is a processor operating mode where the processor behavior and performance is modified by raising TDP and the processor frequency to fixed points. The use of Configurable TDP-up is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-up is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-up frequency under an Intel-defined, high-complexity workload.
Configurable TDP-down Base Frequency
Configurable TDP-down Base Frequency is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The Configurable TDP-down Base Frequency is where the Configurable TDP-down is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.
Configurable TDP-down
Configurable TDP-down is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The use of Configurable TDP-down is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-down is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-down frequency under an Intel-defined, high-complexity workload.
Intel® Deep Learning Boost (Intel® DL Boost) on CPU
A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.
Launch Date
The date the product was first introduced.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Use Conditions
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
GPU Name‡
Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. Processor graphics brands include Intel® Iris® Xe Graphics, Intel® UHD Graphics, Intel® HD Graphics, Iris® Graphics, Iris® Plus Graphics, and Iris® Pro Graphics. See the Intel® Graphics Technology for more information.
Intel® Iris® Xe Graphics only: to use the Intel® Iris® Xe brand, the system must be populated with 128-bit (dual channel) memory. Otherwise, use the Intel® UHD brand.
Intel® Arc™ graphics only available on select H-series Intel® Core™ Ultra processor powered systems with at least 16GB of system memory in a dual-channel configuration. OEM enablement required; check with OEM or retailer for system configuration details.
Graphics Max Dynamic Frequency
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
For more details regarding the dynamic power and frequency operating range, refer to Performance Proxy Frequently Asked Questions (FAQs) for Intel® Processors.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
Execution Units
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.
Max Resolution (HDMI)‡
Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (DP)‡
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
Max Resolution (eDP - Integrated Flat Panel)‡
Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.
DirectX* Support
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
OpenGL* Support
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
OpenCL* Support
OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.
Intel® Quick Sync Video
Intel® Quick Sync Video delivers fast conversion of video for portable media players, online sharing, and video editing and authoring.
Intel® Clear Video HD Technology
Intel® Clear Video HD Technology, like its predecessor, Intel® Clear Video Technology, is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture. Intel® Clear Video HD Technology adds video quality enhancements for richer color and more realistic skin tones.
Intel® Thunderbolt™ 4
Universal computer port that can dynamically adjust data and video bandwidth depending on the device and/or application.
Microprocessor PCIe Revision
Microprocessor PCIe Revision is the version supported by the processor for the PCIe lanes directly attached to the microprocessor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCIe Express version support different data rates.
Chipset / PCH PCIe Revision
Chipset/PCH PCIe Revision is the version supported by the PCH for the PCIe lanes directly attached to the PCH. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCIe Express version support different data rates.
Sockets Supported
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
TJUNCTION
Junction Temperature is the maximum temperature allowed at the processor die.
Max Operating Temperature
This is the maximum operating temperature allowed as reported by temperature sensors. Instantaneous temperature may exceed this value for short durations. Note: Maximum observable temperature is configurable by system vendor and can be design specific.
Intel® Gaussian & Neural Accelerator
Intel® Gaussian & Neural Accelerator (GNA) is an ultra-low power accelerator block designed to run audio and speed-centric AI workloads. Intel® GNA is designed to run audio based neural networks at ultra-low power, while simultaneously relieving the CPU of this workload.
Intel® Image Processing Unit
Intel® Image Processing Unit is an integrated image signal processor with advanced hardware implementation that improves image and video quality of cameras.
Intel® Smart Sound Technology
Intel® Smart Sound Technology is an integrated audio DSP (Digital Signal Processor) built to handle audio, voice, and speech interaction. It allows the latest Intel® Core™ processor-based PCs to respond to your voice command quickly and offer high fidelity audio without impact system performance and battery life.
Intel® High Definition Audio
Audio interface for codecs to communicate with Intel SoCs and chipsets.
MIPI SoundWire*
SoundWire* interface is used by Audio Codecs to communicate with Intel SoCs and chipsets.
Intel® Speed Shift Technology
Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.
Intel® Turbo Boost Technology ‡
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® Hyper-Threading Technology ‡
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Idle States
Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Volume Management Device (VMD)
Intel® Volume Management Device (VMD) provides a common, robust method of hot plug and LED management for NVMe-based solid state drives.
Intel® Control-Flow Enforcement Technology
CET - Intel Control-flow Enforcement Technology (CET) helps protect against the misuse of legitimate code snippets through return-oriented programming (ROP) control-flow hijacking attacks.
Intel® Total Memory Encryption
TME – Total Memory Encryption (TME) helps protect data against exposure via physical attack on memory, such as cold-boot attacks.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Software Guard Extensions (Intel® SGX)
Intel® Software Guard Extensions (Intel® SGX) provide applications the ability to create hardware enforced trusted execution protection for their applications’ sensitive routines and data. Intel® SGX provides developers a way to partition their code and data into CPU hardened trusted execution environments (TEE’s).
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Intel® Boot Guard
Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.
Mode-based Execute Control (MBEC)
Mode-based Execute Control can more reliably verify and enforce the integrity of kernel level code.
Intel® Virtualization Technology (VT-x) ‡
Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® VT-x with Extended Page Tables (EPT) ‡
Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Tray Processor
Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See http://www.intel.com/content/www/us/en/processors/processor-numbers.html for details.
See http://www.intel.com/content/www/us/en/architecture-and-technology/hyper-threading/hyper-threading-technology.html?wapkw=hyper+threading for more information including details on which processors support Intel® HT Technology.
Intel® Iris® Xe Graphics only: to use the Intel® Iris® Xe brand, the system must be populated with 128-bit (dual channel) memory. Otherwise, use the Intel® UHD brand.
Intel® Arc™ graphics only available on select H-series Intel® Core™ Ultra processor powered systems with at least 16GB of system memory in a dual-channel configuration. OEM enablement required; check with OEM or retailer for system configuration details.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information and applicability of this technology.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.