Intel® NUC Rugged Chassis Element CMCR1ABB
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Intel® NUC Chassis Elements
Products formerly Austin Beach
Supported Operating Systems
Windows 10*, Linux*
Board Form Factor
U-series Element Carrier Board
Internal Drive Form Factor
# of Internal Drives Supported
DC Input Voltage Supported
# of Displays Supported ‡
M.2 Card Slot (storage)
2280, 2242/80 (M-key)
USB 3.2g2: 1x front, 2x rear ports
USB 3.1g1: 1x header
USB 2.0: 1x front, 2x rear ports
# of Serial Ports
Serial Port via Internal Header
Intel® i219-LM GbE and Intel® i211-AT GbE
Front panel (PWR_SW, PWR_LED, RST, HDD_Act, 5V, 5Vsby, 3.3Vsby); Internal 2x2 power connector
254 x 152.4 x 36 mm (plus 4.8mm for rubber feet)
Ordering and Compliance
Ordering and spec information
Intel® NUC Rugged Chassis Element CMCR1ABB, US cord, 2 pack
- MM# 999M97
- Ordering Code BKCMCR1ABB1
Intel® NUC Rugged Chassis Element CMCR1ABB, EU cord, 2 pack
- MM# 999M98
- Ordering Code BKCMCR1ABB2
Intel® NUC Rugged Chassis Element CMCR1ABB, no cord, 2 pack
- MM# 999M96
- Ordering Code BKCMCR1ABB
Trade compliance information
- ECCN EAR99
- CCATS NA
- US HTS 8473301180
Drivers and Software
No results found for
The date the product was first introduced.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.
Graphics Output defines the interfaces available to communicate with display devices.
M.2 Card Slot (storage)
M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Additional Headers indicates presence of additional interfaces such as NFC, auxiliary power, and others.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.