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  • Brand Name: Core Ultra

  • Product Number: 6526Y

  • Ordering Code: PK8072205559500

  • SPEC Code: SRN6N

  • Code Name: Emerald Rapids

Intel® HM470 Chipset

Specifications

Export specifications

Essentials

Supplemental Information

Memory Specifications

GPU Specifications

  • # of Displays Supported ‡ 3

I/O Specifications

  • # of USB Ports 14
  • USB Configuration 8 Total USB 3.2 Ports
    - Up to 4 USB 3.2 Gen 2 Ports
    - Up to 8 USB 3.2 Gen 1 Ports
    14 USB 2.0 Ports
  • USB Revision 3.2/2.0
  • Max # of SATA 6.0 Gb/s Ports 4
  • RAID Configuration 0/1/5/10
  • Integrated LAN Integrated MAC
  • Integrated Wireless‡ Intel® Wireless-AX MAC

Package Specifications

  • Package Size 25mm x 24mm

Ordering and Compliance

Ordering and spec information

Intel® FH82HM470 Platform Controller Hub

  • MM# 99A034
  • Spec Code SRJAU
  • Ordering Code FH82HM470
  • Stepping A0
  • MDDS Content IDs 707506

Trade compliance information

  • ECCN 5A992CN3
  • CCATS G158870
  • US HTS 8542310001

PCN Information

SRJAU

Compatible Products

10th Generation Intel® Core™ i9 Processors

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10th Generation Intel® Core™ i7 Processors

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10th Generation Intel® Core™ i5 Processors

Product Name Launch Date Max Turbo Frequency Cache GPU Name‡ Sort Order Compare
All | None
Intel® Core™ i5-10500H Processor Q4'20 4.50 GHz 12 MB Intel® Smart Cache Intel® UHD Graphics for 10th Gen Intel® Processors 8150
Intel® Core™ i5-10300H Processor Q2'20 4.50 GHz 8 MB Intel® Smart Cache Intel® UHD Graphics for 10th Gen Intel® Processors 8240
Intel® Core™ i5-10200H Processor Q3'20 4.10 GHz 8 MB Intel® Smart Cache Intel® UHD Graphics for 10th Gen Intel® Processors 8262

Drivers and Software

Latest Drivers & Software

Downloads Available:
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Name

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Launch Date

The date the product was first introduced.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Supports Overclocking

Overclocking indicates the ability to achieve high core, graphics and memory frequencies by independently raising processor clock speeds without impacting other system components.

Embedded Options Available

“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.

# of DIMMs per channel

DIMMs per Channel indicates the quantity of dual inline memory modules supported per each processor memory channel

PCI Express Revision

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations ‡

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link to PCIe devices.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.

USB Revision

USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.

RAID Configuration

RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.

Integrated LAN

Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.

Intel® Optane™ Memory Supported ‡

Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Visit www.intel.com/OptaneMemory for configuration requirements.

Intel® ME Firmware Version

Intel® Management Engine Firmware (Intel® ME FW) uses built-in platform capabilities and management and security applications to remotely manage networked computing assets out-of-band.

Intel® HD Audio Technology

Intel® High Definition Audio (Intel® HD Audio) is capable of playing back more channels at higher quality than previous integrated audio formats. In addition, Intel® HD Audio has the technology needed to support the latest and greatest audio content.

Intel® Rapid Storage Technology

Intel® Rapid Storage Technology provides protection, performance, and expandability for desktop and mobile platforms. Whether using one or multiple hard drives, users can take advantage of enhanced performance and lower power consumption. When using more than one drive the user can have additional protection against data loss in the event of hard drive failure. Successor to Intel® Matrix Storage Technology.

Intel® Stable IT Platform Program (SIPP)

The Intel® Stable IT Platform Program (Intel® SIPP) aims for zero changes to key platform components and drivers for at least 15 months or until the next generational release, reducing complexity for IT to effectively manage their computing endpoints.
Learn more about Intel® SIPP

Intel® Smart Sound Technology

Intel® Smart Sound Technology is an integrated digital signal processor (DSP) for audio offload and audio/voice features

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Intel® Boot Guard

Intel® Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

WARNING: Altering clock frequency and/or voltage may: (i) reduce system stability and useful life of the system and processor; (ii) cause the processor and other system components to fail; (iii) cause reductions in system performance; (iv) cause additional heat or other damage; and (v) affect system data integrity. Intel has not tested, and does not warranty, the operation of the processor beyond its specifications. Intel assumes no responsibility that the processor, including if used with altered clock frequencies and/or voltages, will be fit for any particular purpose. For more information, visit http://www.intel.com/content/www/us/en/gaming/overclocking/overclocking-intel-processors.html

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.