Intel® Server Board MYP1USVB
Specifications
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Essentials
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Product Collection
Intel® Server Board M20MYP
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Code Name
Products formerly Mystic Pass
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Marketing Status
Discontinued
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Launch Date
Q2'20
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Expected Discontinuance
2023
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# of QPI Links
2
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Supported Operating Systems
Windows Server 2019*, Windows Server 2016*, Red Hat Enterprise Linux 7.6*, Red Hat Enterprise Linux 7.5*, SUSE Linux Enterprise Server 15*, SUSE Linux Enterprise Server 12 SP4*, Ubuntu*
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Compatible Product Series
2nd Generation Intel® Xeon® Scalable Processors
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Board Form Factor
SSI EEB (12 x 13 in)
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Chassis Form Factor
Rack or Pedestal
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Socket
P
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Integrated Systems Available
No
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Integrated BMC with IPMI
IPMI 2.0 & Redfish
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Rack-Friendly Board
Yes
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TDP
205 W
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Included Items
(1) Intel® Server Board MYP1USVB
(2) SATA cables 880.00mm
(1) IO shield
(1) Protective insulator
(1) Configuration label (sticker to be added to chassis)
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Board Chipset
Intel® C624 Chipset
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Target Market
Small and Medium Business
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Supplemental Information
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Embedded Options Available
No
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Description
A standard form factor server board supporting two 2nd Generation Intel® Xeon® Scalable Processors, up to 205 W TDP, 16 DIMMs, and Dual 10GBase-T ports.
Board only is available as S2600STBR MM# 986246
Memory Specifications
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Max Memory Size (dependent on memory type)
2 TB
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Memory Types
DDR4 ECC RDIMM/LRDIMM 2133/2400/2666/2933
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Max # of Memory Channels
16
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# of Memory Slots
16
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ECC Memory Supported ‡
Yes
GPU Specifications
Expansion Options
I/O Specifications
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# of USB Ports
7
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USB Revision
2.0 & 3.0
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Total # of SATA Ports
12
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RAID Configuration
RAID 0/1/10 (5 optional)
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# of Serial Ports
1
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# of LAN Ports
2
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Integrated LAN
(Optional) two 10 Gb SFP+ connectors
Package Specifications
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Max CPU Configuration
2
Advanced Technologies
Security & Reliability
Compatible Products
Intel® Server System M20MYP Family
Drivers and Software
Description
Type
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OS
Version
Date
All
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Latest Drivers & Software
Name
Intel® Server Chipset Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 62X Chipset
Onboard Video Driver for Windows* for Intel® Server Boards and Systems Based on Intel® 62X Chipset
Onboard Video Driver for Linux* for Intel® Server Boards and Systems Based on Intel® 62X Chipset
Onboard Network Driver for Intel® Server Boards and Systems Based on Intel® 62X Chipset
Intel® Embedded Server RAID Technology 2 (ESRT2) Windows* Driver for Intel® Server Boards and Systems Based on Intel® 62X Chipset
Intel® Embedded Server RAID Technology 2 (ESRT2) Linux* Driver for Intel® Server Boards and Systems Based on Intel® 62X Chipset
Intel® Configuration Detector for Linux*
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
# of QPI Links
QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.
Integrated BMC with IPMI
IPMI (Intelligent Platform Management Interface) is a standardized interface used for out-of-band management of computer systems. The integrated BMC (Baseboard Management Controller) is a specialized microcontroller that enables IPMI.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
ECC Memory Supported ‡
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Integrated Graphics ‡
Integrated graphics allow for incredible visual quality, faster graphic performance and flexible display options without the need for a separate graphics card.
Graphics Output
Graphics Output defines the interfaces available to communicate with display devices.
PCI Express Revision
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. Max # of PCI Express Lanes is the total number of supported lanes.
PCIe x8 Gen 3
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe x16 Gen 3
PCIe (Peripheral Component Interconnect Express) is a high speed serial computer expansion bus standard for attaching hardware devices to a computer. This field indicates the number of PCIe sockets for the given lane configuration (x8, x16) and PCIe generation (1.x, 2.x).
PCIe OCuLink Connectors (NVMe support)
Onboard PCIe OCuLink connectors provide direct-attach NVMe SSD support.
USB Revision
USB (Universal Serial Bus) is an industry standard connection technology for attaching peripheral devices to a computer.
Total # of SATA Ports
SATA (Serial Advanced Technology Attachment) is a high speed standard for connecting storage devices such as hard disk drives and optical drives to a motherboard.
RAID Configuration
RAID (Redundant Array of Independent Disks) is a storage technology that combines multiple disk drive components into a single logical unit, and distributes data across the array defined by RAID levels, indicative of the level of redundancy and performance required.
# of Serial Ports
A Serial Port is a computer interface used for connecting peripherals.
# of LAN Ports
LAN (Local Area Network) is a computer network, typically Ethernet, that interconnects computers over a limited geographical area such as a single building.
Integrated LAN
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Intel® Virtualization Technology for Directed I/O (VT-d) ‡
Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® Remote Management Module Support
The Intel® Remote Management Module (Intel® RMM) allows you to securely gain access and control servers and other devices from any machine on the network. Remote access includes remote management capability, including power control, KVM, and media redirection, with a dedicated management network interface card (NIC).
Intel® Node Manager
Intel® Intelligent Power Node Manager is a platform resident technology that enforces power and thermal policies for the platform. It enables data center power and thermal management by exposing an external interface to management software through which platform policies can be specified. It also enables specific data center power management usage models such as power limiting.
TPM Version
TPM (Trusted Platform Module) is a component that provides hardware level security upon system boot-up via stored security keys, passwords, encryption and hash functions.
Intel® AES New Instructions
Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Intel® Trusted Execution Technology ‡
Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.