Intel® Ethernet Controller V710-AT2
Specifications
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Essentials
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Product Collection
Intel® Ethernet Controller V710
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Code Name
Products formerly Carlsville
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Marketing Status
Launched
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Launch Date
Q2'20
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Expected Discontinuance
Q2'30
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TDP
9.5 W
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Supported Operating Systems
View now
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Operating Temperature Range
0°C to 55°C
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Max Operating Temperature
55 °C
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Minimum Operating Temperature
0 °C
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Use Conditions
Server/Enterprise
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Supplemental Information
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Embedded Options Available
No
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Description
Multiple speed, energy-efficient design for NBASE-T
networks and 802.3bz
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Product Brief
View now
Networking Specifications
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Port Configuration
Dual
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Data Rate Per Port
5/2.5/1GbE, 100Mb
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System Interface Type
PCIe 3.0 (8.0 GT/s)
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Jumbo Frames Supported
Yes
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Interfaces Supported
NBASE-T, 100BASE-T, 1000BASE-T
Package Specifications
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Package Size
22mm x 22mm
Intel® Virtualization Technology for Connectivity
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On-chip QoS and Traffic Management
Yes
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Flexible Port Partitioning
Yes
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Virtual Machine Device Queues (VMDq)
Yes
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PCI-SIG* SR-IOV Capable
Yes
Advanced Technologies
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Intel® Data Direct I/O Technology
Yes
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Intelligent Offloads
Yes
Ordering and Compliance
Drivers and Software
Description
Type
More
OS
Version
Date
All
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Latest Drivers & Software
Name
Intel® Ethernet Adapter Complete Driver Pack
Intel® Ethernet Product Release Notes
Intel® Network Adapter Driver for Microsoft Windows 11*
Intel® Network Adapter Driver for Windows Server 2022*
Administrative Tools for Intel® Network Adapters
Intel® Ethernet Connections Boot Utility, Preboot Images, and EFI Drivers
Adapter User Guide for Intel® Ethernet Adapters
NVM Downgrade Packages for Intel® Ethernet Adapters 700 Series
Intel® Network Adapter FreeBSD* Virtual Function Driver for Intel® Ethernet Controller 700 and E810 Series
Support
Launch Date
The date the product was first introduced.
Expected Discontinuance
Expected Discontinuance is an estimate of when a product will begin the Product Discontinuance process. The Product Discontinuance Notification (PDN), published at the start of the discontinuance process, will include all EOL Key Milestone details. Some business units may communicate EOL timeline details before the PDN is published. Contact your Intel representative for information on EOL timelines and extended life options.
TDP
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Max Operating Temperature
This is the maximum operating temperature allowed as reported by temperature sensors. Instantaneous temperature may exceed this value for short durations. Note: Maximum observable temperature is configurable by system vendor and can be design specific.
Use Conditions
Use conditions are the environmental and operating conditions derived from the context of system use.
For SKU specific use condition information, see PRQ report.
For current use condition information, see Intel UC (CNDA site)*.
Embedded Options Available
“Embedded Options Available” indicates the SKU is typically available for purchase for 7 years from the launch of the first SKU in the Product family and may be available for purchase for a longer period of time under certain circumstances. Intel does not commit or guarantee product Availability or Technical Support by way of roadmap guidance. Intel reserves the right to change roadmaps or discontinue products, software and software support services through standard EOL/PDN processes. Product certification and use condition information can be found in the Production Release Qualification (PRQ) report for this SKU. Contact your Intel representative for details.
Flexible Port Partitioning
Flexible Port Partitioning (FPP) technology utilizes industry standard PCI SIG SR-IOV to efficiently divide your physical Ethernet device into multiple virtual devices, providing Quality of Service by ensuring each process is assigned to a Virtual Function and is provided a fair share of the bandwidth.
Virtual Machine Device Queues (VMDq)
Virtual Machine Device Queues (VMDq) is a technology designed to offload some of the switching done in the VMM (Virtual Machine Monitor) to networking hardware specifically designed for this function. VMDq drastically reduces overhead associated with I/O switching in the VMM which greatly improves throughput and overall system performance
PCI-SIG* SR-IOV Capable
Single-Root I/O Virtualization (SR-IOV) involves natively (directly) sharing a single I/O resource between multiple virtual machines. SR-IOV provides a mechanism by which a Single Root Function (for example a single Ethernet Port) can appear to be multiple separate physical devices.
Intel® Data Direct I/O Technology
Intel® Data Direct I/O Technology is a platform technology that improves I/O data processing efficiency for data delivery and data consumption from I/O devices. With Intel DDIO, Intel® Server Adapters and controllers talk directly to the processor cache without a detour via system memory, reducing latency, increasing system I/O bandwidth, and reducing power consumption.
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for general, educational and planning purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.