Intel® NUC Assembly Element CMA1BB
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Intel® NUC Assembly Elements
Products formerly Butler Beach
Supported Operating Systems
Windows 11*, Windows 10*, Linux*
Board Form Factor
U-series Element Carrier Board
Internal Drive Form Factor
# of Internal Drives Supported
DC Input Voltage Supported
Dual HDMI 2.0, eDP
M.2 Card Slot (storage)
2280 M-key (NVMe/SATA)
117 x 147 x 25 mm
Ordering and Compliance
Drivers and Software
No results found for
Latest Drivers & Software
The date the product was first introduced.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Warranty document for this product is available on https://supporttickets.intel.com/warrantyinfo.
Graphics Output defines the interfaces available to communicate with display devices.
M.2 Card Slot (storage)
M.2 Card Slot (storage) indicates presence of an M.2 slot that's keyed for storage expansion cards
Integrated LAN indicates the presence of an integrated Intel Ethernet MAC or presence of the LAN ports built into the system board.
Additional Headers indicates presence of additional interfaces such as NFC, auxiliary power, and others.
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.